JPS6219056B2 - - Google Patents

Info

Publication number
JPS6219056B2
JPS6219056B2 JP19379382A JP19379382A JPS6219056B2 JP S6219056 B2 JPS6219056 B2 JP S6219056B2 JP 19379382 A JP19379382 A JP 19379382A JP 19379382 A JP19379382 A JP 19379382A JP S6219056 B2 JPS6219056 B2 JP S6219056B2
Authority
JP
Japan
Prior art keywords
resin
receiver
lead frame
stripper plate
upper support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP19379382A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5982733A (ja
Inventor
Hideji Aoki
Junichi Yoshioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP19379382A priority Critical patent/JPS5982733A/ja
Publication of JPS5982733A publication Critical patent/JPS5982733A/ja
Publication of JPS6219056B2 publication Critical patent/JPS6219056B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP19379382A 1982-11-02 1982-11-02 樹脂封止半導体装置の不要樹脂除去装置 Granted JPS5982733A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19379382A JPS5982733A (ja) 1982-11-02 1982-11-02 樹脂封止半導体装置の不要樹脂除去装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19379382A JPS5982733A (ja) 1982-11-02 1982-11-02 樹脂封止半導体装置の不要樹脂除去装置

Publications (2)

Publication Number Publication Date
JPS5982733A JPS5982733A (ja) 1984-05-12
JPS6219056B2 true JPS6219056B2 (enrdf_load_html_response) 1987-04-25

Family

ID=16313872

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19379382A Granted JPS5982733A (ja) 1982-11-02 1982-11-02 樹脂封止半導体装置の不要樹脂除去装置

Country Status (1)

Country Link
JP (1) JPS5982733A (enrdf_load_html_response)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02150520A (ja) * 1988-11-30 1990-06-08 Fanuc Ltd モータ用電磁ブレーキ装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02150520A (ja) * 1988-11-30 1990-06-08 Fanuc Ltd モータ用電磁ブレーキ装置

Also Published As

Publication number Publication date
JPS5982733A (ja) 1984-05-12

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