JPS6218616B2 - - Google Patents
Info
- Publication number
- JPS6218616B2 JPS6218616B2 JP55169945A JP16994580A JPS6218616B2 JP S6218616 B2 JPS6218616 B2 JP S6218616B2 JP 55169945 A JP55169945 A JP 55169945A JP 16994580 A JP16994580 A JP 16994580A JP S6218616 B2 JPS6218616 B2 JP S6218616B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- alloy
- materials
- conductivity
- lead material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55169945A JPS5793556A (en) | 1980-12-02 | 1980-12-02 | Lead material for high heat resistant conductive semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55169945A JPS5793556A (en) | 1980-12-02 | 1980-12-02 | Lead material for high heat resistant conductive semiconductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5793556A JPS5793556A (en) | 1982-06-10 |
| JPS6218616B2 true JPS6218616B2 (enExample) | 1987-04-23 |
Family
ID=15895794
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55169945A Granted JPS5793556A (en) | 1980-12-02 | 1980-12-02 | Lead material for high heat resistant conductive semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5793556A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5138170B2 (ja) * | 2006-02-12 | 2013-02-06 | 三菱伸銅株式会社 | 銅合金製塑性加工材及びその製造方法 |
-
1980
- 1980-12-02 JP JP55169945A patent/JPS5793556A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5793556A (en) | 1982-06-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0229737B2 (enExample) | ||
| JPH01272733A (ja) | 半導体装置用Ｃｕ合金製リードフレーム材 | |
| JPS6160846A (ja) | 半導体装置用銅合金リ−ド材 | |
| JPS63307232A (ja) | 銅合金 | |
| US4710349A (en) | Highly conductive copper-based alloy | |
| JP2956696B1 (ja) | 高強度・高導電性銅合金およびその加工方法 | |
| JPS6256937B2 (enExample) | ||
| JPH0635633B2 (ja) | 電気および電子部品用銅合金及びその製造方法 | |
| JPS6218616B2 (enExample) | ||
| JPH02111829A (ja) | リードフレーム用銅合金 | |
| JPS60194030A (ja) | 半導体機器のリ−ド材用銅合金 | |
| JPS5952943B2 (ja) | 高耐熱性および高導電性を有するＣｕ合金 | |
| JPH05311364A (ja) | 高強度高導電性銅合金の製造方法 | |
| JPS6142772B2 (enExample) | ||
| JPS6140290B2 (enExample) | ||
| JPH0356294B2 (enExample) | ||
| JPS58147140A (ja) | 半導体装置のリ−ド材 | |
| JPS58147139A (ja) | 半導体装置のリ−ド材 | |
| JPH02129326A (ja) | 高力銅合金 | |
| JPS63161134A (ja) | 電気部品用銅合金 | |
| JPH01263238A (ja) | 高強度高導電性銅合金 | |
| JPS63161135A (ja) | 電気部品用銅合金 | |
| JPS60245750A (ja) | 半導体機器のリ−ド材用銅合金 | |
| JPH0253502B2 (enExample) | ||
| JPS6242018B2 (enExample) |