JPS5793556A - Lead material for high heat resistant conductive semiconductor - Google Patents
Lead material for high heat resistant conductive semiconductorInfo
- Publication number
- JPS5793556A JPS5793556A JP55169945A JP16994580A JPS5793556A JP S5793556 A JPS5793556 A JP S5793556A JP 55169945 A JP55169945 A JP 55169945A JP 16994580 A JP16994580 A JP 16994580A JP S5793556 A JPS5793556 A JP S5793556A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- high heat
- heat resistant
- conductive semiconductor
- lead material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55169945A JPS5793556A (en) | 1980-12-02 | 1980-12-02 | Lead material for high heat resistant conductive semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55169945A JPS5793556A (en) | 1980-12-02 | 1980-12-02 | Lead material for high heat resistant conductive semiconductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5793556A true JPS5793556A (en) | 1982-06-10 |
| JPS6218616B2 JPS6218616B2 (enExample) | 1987-04-23 |
Family
ID=15895794
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55169945A Granted JPS5793556A (en) | 1980-12-02 | 1980-12-02 | Lead material for high heat resistant conductive semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5793556A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007211317A (ja) * | 2006-02-12 | 2007-08-23 | Sanbo Copper Alloy Co Ltd | 銅合金製塑性加工材及びその製造方法 |
-
1980
- 1980-12-02 JP JP55169945A patent/JPS5793556A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007211317A (ja) * | 2006-02-12 | 2007-08-23 | Sanbo Copper Alloy Co Ltd | 銅合金製塑性加工材及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6218616B2 (enExample) | 1987-04-23 |
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