JPS5793556A - Lead material for high heat resistant conductive semiconductor - Google Patents

Lead material for high heat resistant conductive semiconductor

Info

Publication number
JPS5793556A
JPS5793556A JP55169945A JP16994580A JPS5793556A JP S5793556 A JPS5793556 A JP S5793556A JP 55169945 A JP55169945 A JP 55169945A JP 16994580 A JP16994580 A JP 16994580A JP S5793556 A JPS5793556 A JP S5793556A
Authority
JP
Japan
Prior art keywords
lead
high heat
heat resistant
conductive semiconductor
lead material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55169945A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6218616B2 (enExample
Inventor
Rensei Futatsuka
Tadao Sakakibara
Shuntaro Tatsuta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Shindoh Co Ltd
Original Assignee
Mitsubishi Shindoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Shindoh Co Ltd filed Critical Mitsubishi Shindoh Co Ltd
Priority to JP55169945A priority Critical patent/JPS5793556A/ja
Publication of JPS5793556A publication Critical patent/JPS5793556A/ja
Publication of JPS6218616B2 publication Critical patent/JPS6218616B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials

Landscapes

  • Conductive Materials (AREA)
JP55169945A 1980-12-02 1980-12-02 Lead material for high heat resistant conductive semiconductor Granted JPS5793556A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55169945A JPS5793556A (en) 1980-12-02 1980-12-02 Lead material for high heat resistant conductive semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55169945A JPS5793556A (en) 1980-12-02 1980-12-02 Lead material for high heat resistant conductive semiconductor

Publications (2)

Publication Number Publication Date
JPS5793556A true JPS5793556A (en) 1982-06-10
JPS6218616B2 JPS6218616B2 (enExample) 1987-04-23

Family

ID=15895794

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55169945A Granted JPS5793556A (en) 1980-12-02 1980-12-02 Lead material for high heat resistant conductive semiconductor

Country Status (1)

Country Link
JP (1) JPS5793556A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007211317A (ja) * 2006-02-12 2007-08-23 Sanbo Copper Alloy Co Ltd 銅合金製塑性加工材及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007211317A (ja) * 2006-02-12 2007-08-23 Sanbo Copper Alloy Co Ltd 銅合金製塑性加工材及びその製造方法

Also Published As

Publication number Publication date
JPS6218616B2 (enExample) 1987-04-23

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