JPS62184765U - - Google Patents
Info
- Publication number
- JPS62184765U JPS62184765U JP7242686U JP7242686U JPS62184765U JP S62184765 U JPS62184765 U JP S62184765U JP 7242686 U JP7242686 U JP 7242686U JP 7242686 U JP7242686 U JP 7242686U JP S62184765 U JPS62184765 U JP S62184765U
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- light emitting
- chip
- diode device
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Description
第１図は本考案の一実施例を示す側断面図、第
２図は実施例を形成する成形例を示す側断面図、
第３図は従来例を示す側断面図である。 １，２：リード、３：発光ダイオードチツプ、
４：接続用金線、５：樹脂封止部、５ａ：レンズ
部、６：光反射性の筒、７：抜き型。
２図は実施例を形成する成形例を示す側断面図、
第３図は従来例を示す側断面図である。 １，２：リード、３：発光ダイオードチツプ、
４：接続用金線、５：樹脂封止部、５ａ：レンズ
部、６：光反射性の筒、７：抜き型。
Claims (1)
- 並設された複数のリードの少なくとも１本に発
光ダイオードチツプをマウントし、前記チツプ及
び該チツプのマウント周辺のリード部全体を樹脂
封止によりパツケージしてなる発光ダイオード装
置において、発光取出し面のレンズ部のみ露出さ
せて前記樹脂封止部の外側側面を覆うように光反
射性を有する筒を設けたことを特徴とする発光ダ
イオード装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7242686U JPS62184765U (ja) | 1986-05-13 | 1986-05-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7242686U JPS62184765U (ja) | 1986-05-13 | 1986-05-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62184765U true JPS62184765U (ja) | 1987-11-24 |
Family
ID=30915859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7242686U Pending JPS62184765U (ja) | 1986-05-13 | 1986-05-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62184765U (ja) |
-
1986
- 1986-05-13 JP JP7242686U patent/JPS62184765U/ja active Pending