JPS62183146A - Ceramic package for semiconductor device - Google Patents
Ceramic package for semiconductor deviceInfo
- Publication number
- JPS62183146A JPS62183146A JP2533486A JP2533486A JPS62183146A JP S62183146 A JPS62183146 A JP S62183146A JP 2533486 A JP2533486 A JP 2533486A JP 2533486 A JP2533486 A JP 2533486A JP S62183146 A JPS62183146 A JP S62183146A
- Authority
- JP
- Japan
- Prior art keywords
- weld ring
- cavity
- weld
- ring
- ceramic package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 20
- 239000004065 semiconductor Substances 0.000 title claims abstract description 14
- 239000002184 metal Substances 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract 3
- 238000005219 brazing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、半導体装置用セラミックパッケージに関し、
特にウェルドリングを有する半導体装置用セラミックパ
ッケージに関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a ceramic package for a semiconductor device,
In particular, the present invention relates to a ceramic package for semiconductor devices having a weld ring.
従来、この檻の半導体装置用セラミックパッケージは、
第３図の断面図に示すよりに、中央部に半導体素子を固
定するためのキャビティ２を有するセラミック基体１１
のキャビティ２の周囲の上面には、キャビティ２に半導
体素子を収容後、キャビティの開口に蓋をするキャップ
を溶接するために、金属のウェルドリング４が、ろう付
けなどによシ接合されておった。Conventionally, this caged ceramic package for semiconductor devices was
As shown in the cross-sectional view of FIG. 3, a ceramic base 11 has a cavity 2 in the center for fixing a semiconductor element.
A metal weld ring 4 is bonded to the upper surface around the cavity 2 by brazing or the like in order to weld a cap that covers the opening of the cavity after the semiconductor element is housed in the cavity 2. Ta.
上述した従来の半導体装置用セラミックパッケージは、
ウェルドリング取付けを行なうときに専用治具が必要で
あυ、また、取付は位置精度を出しにくいという欠点が
ある。The conventional ceramic package for semiconductor devices mentioned above is
A special jig is required when attaching the weld ring, and there is also the disadvantage that it is difficult to achieve positional accuracy when attaching the weld ring.
上記問題点に対し、本発明では、セラミック基体の、半
導体素子を収容固着するキャビティ周囲の上面に、この
キャビティに蓋をするだめのキャップヲ浴接するウェル
ドリング位置決め用の凸部または凹部を設けている。In order to solve the above problems, the present invention provides a convex part or a concave part on the upper surface of the ceramic base around the cavity in which the semiconductor element is housed and fixed, for positioning the weld ring that contacts the cap for covering the cavity. .
つぎに本発明を実施例によシ説明する。 Next, the present invention will be explained using examples.
第１図（ａ）は本発明の一実施例のキャップを除いた平
面図、同図（ｂｌは同図（ａ）のＡ−Ａ断面図である。FIG. 1(a) is a plan view of an embodiment of the present invention with the cap removed, and FIG. 1(b) is a cross-sectional view taken along line A-A in FIG.
第１図＋ａ） 、 （ｂ）において、これを第３図に示
した従来例と比べると、セラミック基体１のキャビティ
２の周囲上面に、ウェルドリンク４が接合されているの
は同じであるが、本例においては、四角形のウェルドリ
ンク４の相対向する一対の内側面に沿って、ウェルドリ
ンク４の位置決め用の凸部３が設けられているのが第３
図の従来例と違っている。In Fig. 1+a) and (b), when comparing this with the conventional example shown in Fig. 3, it is the same that the weld link 4 is joined to the upper surface of the periphery of the cavity 2 of the ceramic base 1. In this example, the third protrusion 3 for positioning the well link 4 is provided along a pair of opposing inner surfaces of the rectangular well link 4.
This is different from the conventional example shown in the figure.
第２図は本発明の他の実施例の断面図であり、本例では
ウェルドリンク４は、セラミック基体５の半導体素子固
着用キャビティ２の周囲上面に設けた凹部６に、丁度は
まることによってウェルドリンク４の位置決めがなされ
ている。FIG. 2 is a cross-sectional view of another embodiment of the present invention. In this embodiment, the well link 4 fits into the recess 6 provided on the upper surface of the periphery of the semiconductor element fixing cavity 2 of the ceramic base 5. Drink 4 has been positioned.
以上説明したよりに本発明は、セラミック基体の半導体
素子固定のキャビティ周囲上面に１ウェルドリング位置
決め用の凸部または凹部を設けることによシ、ウェルド
リング取付は用専用治具が不要となり、また、ウェルド
リング取付は精度を向上させる効果がある。As explained above, the present invention provides a convex portion or a concave portion for positioning one weld ring on the upper surface around the cavity for fixing the semiconductor element of the ceramic base, thereby eliminating the need for a special jig for mounting the weld ring, and , weld ring attachment has the effect of improving accuracy.
第１図（ａ）は本発明の一実施例のキャップを除いた平
面図、同図（ｂ）は同図（ａＪのＡ−Ａ断面図である。
第２図は本発明の他の実施例のキャップなしの断面図、
第３図は従来のセラミックパッケージのキャップなしの
断面図である。
１．５．１１・・・・・・セラミック基体、２・・・・
・・キャビティ、３・・・・・・ウェルドリング位置決
め用凸部。
４・・・・・・ウェルドリング、６・・・・・・位置決
め用凹部。
ゝ−′−一二FIG. 1(a) is a plan view of one embodiment of the present invention with the cap removed, and FIG. Example cross section without cap,
FIG. 3 is a sectional view of a conventional ceramic package without a cap. 1.5.11...Ceramic base, 2...
...Cavity, 3...Protrusion for positioning the weld ring. 4... Weld ring, 6... Positioning recess.ゝ−′−12
Claims (1)
ルドリングをセラミック基体のキャビティ周囲の上面に
有する半導体装置用セラミックパッケージにおいて、前
記ウエルドリング位置決めのための凸部または凹部を前
記セラミック基体の上面に有することを特徴とする半導
体装置用セラミックパッケージ。A ceramic package for a semiconductor device having a weld ring on the upper surface around a cavity of a ceramic base for sealing a metal cap with a seam weld, the ceramic base having a protrusion or a recess for positioning the weld ring on the upper surface of the ceramic base. A ceramic package for semiconductor devices characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2533486A JPS62183146A (en) | 1986-02-06 | 1986-02-06 | Ceramic package for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2533486A JPS62183146A (en) | 1986-02-06 | 1986-02-06 | Ceramic package for semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62183146A true JPS62183146A (en) | 1987-08-11 |
Family
ID=12163023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2533486A Pending JPS62183146A (en) | 1986-02-06 | 1986-02-06 | Ceramic package for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62183146A (en) |
-
1986
- 1986-02-06 JP JP2533486A patent/JPS62183146A/en active Pending
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