JPS621291A - Semiconductor laser device - Google Patents

Abstract

PURPOSE:To increase adhesive strength, and to reduce thermal resistance by forming irregularities to the bottom of a semiconductor laser element, also shaping irregularities at a position, where the semiconductor laser element is bonded, on a heat sink and fusion-bonding the semiconductor laser element and the irregularities of the heat sink so as to be mutually engaged. CONSTITUTION:Irregularities are formed to the bottom of a semiconductor laser element 4 and one part of the surface of a heat sink 5 at intervals of several dozen mum, the semiconductor laser element 4 and the heat sink 5 are mounted so that mutual irregularities are engaged excellently, and the base of the laser element 4 and one part of the surface of the heat sink 5 are fusion- bonded by a fusion metal 3. A laser outgoing surface for the semiconductor laser element 4 and one end surface of the heat sink 5 are both positioned so s to be disposed on the same plane. Accordingly, positioning is made precise, and the surface area of adhesion is increased, thus augmenting adhesive strength while lowering thermal resistance, then acquiring the high effect of heat dissipation.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a semiconductor laser device that can be used in compact disc players, video disc players, and the like.

2. Description of the Related Art In recent years, semiconductor laser devices have come to occupy an increasingly important position as demand for compact disc players, video disc players, etc. has increased, and high reliability has been required.

Hereinafter, a conventional semiconductor laser device will be explained with reference to the drawings. In FIG. 2, 1 is a semiconductor laser element, and 2 is a heat sink on which the semiconductor laser element 1 is fused and mounted. is fused to. Reference numeral 3 denotes fused gold deposited on the surface of the heat sink 20. When operating the semiconductor laser device configured in this manner, a voltage is applied between the semiconductor laser element 1 and the heat sink 20.

Problems to be Solved by the Invention However, in the above configuration, the heat generated in the semiconductor laser element 1 during laser oscillation is dissipated from the bottom surface of the semiconductor laser element 1 attached to the heat sink 2. However, due to the small base area, heat cannot be dissipated sufficiently. Furthermore, when the semiconductor laser element 1 is fused to the heat sink 2, the fusion position is not clear, so it may be deviated from the center line A-A' as shown in Figure 3, or tilted as shown in Figure 4. It is fused. Further, at this time, since only the bottom surface of the semiconductor laser cable 1 is fused, sufficient adhesion strength may not be obtained, resulting in a problem that thermal resistance also increases.

In view of the above-mentioned problems, the present invention has been developed to improve the accuracy of the fusion position of semiconductor laser elements, to strengthen the bonding strength, to lower the thermal resistance, and to sufficiently dissipate the heat generated during laser oscillation. The present invention provides a laser device.

Means for Solving the Problems In order to solve the above problems, we formed irregularities on the bottom surface of the semiconductor laser element, and also created irregularities at the position where the semiconductor laser element was bonded on the heat sink. The concave and convex portions of the material are fused together so that they interlock with each other.

Function: The unevenness pre-prepared at a predetermined position on the heat sink and the unevenness on the bottom surface of the semiconductor laser element are engaged and bonded together, so the semiconductor laser element will not be misaligned or fixed at an angle, and alignment will be easier. becomes accurate. Also,
Since the bonding area becomes larger, the bonding strength is improved, and the thermal resistance is small, so that the heat emitted from the semiconductor laser element can be sufficiently dissipated.

Example Embodiments will be described in detail below with reference to the drawings.

FIG. 1 shows an embodiment of the present invention, in which 4 is a semiconductor laser element, 6 is a heat sink to which the semiconductor laser element 4 is fused, and the bottom surface of the semiconductor laser element 4 and a part of the surface of the heat sink 60 are shown. Concave and convex portions are provided at intervals of several tens of micrometers, and the concave and convex portions are placed so that they mesh well with each other, and are fused together by a welding metal 3. In addition, the semiconductor laser element 4
The laser emitting surface of the heat sink 5 and one side of the heat sink 5 are positioned so that they are both on the same plane.

As described in detail, according to the present invention, the unevenness provided in advance at a predetermined position of the heat sink and the unevenness on the bottom surface of the semiconductor laser element are engaged and bonded together, so that accurate alignment can be achieved. In addition, since the adhesive surface area is increased, the adhesive strength is improved and the thermal resistance is lowered, resulting in a high heat dissipation effect.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a semiconductor laser device according to an embodiment of the present invention, FIG. 2 is a perspective view of a conventional semiconductor laser device, and FIGS. It is a top view which shows the example which is fixed to the stem in an inclined manner. 1.4... Semiconductor laser element, 2.6...
...Heat sink, 3...Fusion metal. Name of agent: Patent attorney Toshio Nakao and one other person J°”
°sha 11 Figure 2 1

Claims (1)

[Claims] Recesses or protrusions are formed on the surface of the semiconductor laser element on the side to be fused to the heat sink and on the surface of the heat sink to which the semiconductor laser element is fused, respectively, and the recesses or protrusions of the semiconductor laser element and the surface of the heat sink are formed. A semiconductor laser device characterized by having convex portions or concave portions that fit together.