JPS62180957U - - Google Patents
Info
- Publication number
- JPS62180957U JPS62180957U JP6901886U JP6901886U JPS62180957U JP S62180957 U JPS62180957 U JP S62180957U JP 6901886 U JP6901886 U JP 6901886U JP 6901886 U JP6901886 U JP 6901886U JP S62180957 U JPS62180957 U JP S62180957U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- support lead
- view
- sealed insulated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 230000017525 heat dissipation Effects 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims description 2
- 238000005498 polishing Methods 0.000 claims 1
- 238000009413 insulation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6901886U JPS62180957U (zh) | 1986-05-06 | 1986-05-06 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6901886U JPS62180957U (zh) | 1986-05-06 | 1986-05-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62180957U true JPS62180957U (zh) | 1987-11-17 |
Family
ID=30909368
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6901886U Pending JPS62180957U (zh) | 1986-05-06 | 1986-05-06 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62180957U (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01158756A (ja) * | 1987-12-16 | 1989-06-21 | Sanken Electric Co Ltd | 樹脂封止型半導体装置の製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55146952A (en) * | 1979-05-02 | 1980-11-15 | Hitachi Ltd | Lead frame |
JPS58143538A (ja) * | 1982-02-19 | 1983-08-26 | Matsushita Electronics Corp | 樹脂封止形半導体装置の製造方法 |
JPS60128646A (ja) * | 1983-12-16 | 1985-07-09 | Hitachi Ltd | 絶縁型パワートランジスタの製造方法 |
JPS6156420A (ja) * | 1984-07-31 | 1986-03-22 | Sanken Electric Co Ltd | 樹脂封止形半導体装置の製造方法 |
-
1986
- 1986-05-06 JP JP6901886U patent/JPS62180957U/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55146952A (en) * | 1979-05-02 | 1980-11-15 | Hitachi Ltd | Lead frame |
JPS58143538A (ja) * | 1982-02-19 | 1983-08-26 | Matsushita Electronics Corp | 樹脂封止形半導体装置の製造方法 |
JPS60128646A (ja) * | 1983-12-16 | 1985-07-09 | Hitachi Ltd | 絶縁型パワートランジスタの製造方法 |
JPS6156420A (ja) * | 1984-07-31 | 1986-03-22 | Sanken Electric Co Ltd | 樹脂封止形半導体装置の製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01158756A (ja) * | 1987-12-16 | 1989-06-21 | Sanken Electric Co Ltd | 樹脂封止型半導体装置の製造方法 |