JPS6382945U - - Google Patents

Info

Publication number
JPS6382945U
JPS6382945U JP1986176822U JP17682286U JPS6382945U JP S6382945 U JPS6382945 U JP S6382945U JP 1986176822 U JP1986176822 U JP 1986176822U JP 17682286 U JP17682286 U JP 17682286U JP S6382945 U JPS6382945 U JP S6382945U
Authority
JP
Japan
Prior art keywords
resin
covered
semiconductor device
utility
scope
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986176822U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986176822U priority Critical patent/JPS6382945U/ja
Publication of JPS6382945U publication Critical patent/JPS6382945U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1986176822U 1986-11-17 1986-11-17 Pending JPS6382945U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986176822U JPS6382945U (zh) 1986-11-17 1986-11-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986176822U JPS6382945U (zh) 1986-11-17 1986-11-17

Publications (1)

Publication Number Publication Date
JPS6382945U true JPS6382945U (zh) 1988-05-31

Family

ID=31117442

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986176822U Pending JPS6382945U (zh) 1986-11-17 1986-11-17

Country Status (1)

Country Link
JP (1) JPS6382945U (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0878558A (ja) * 1994-09-08 1996-03-22 Kyocera Corp 半導体素子収納用パッケージ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0878558A (ja) * 1994-09-08 1996-03-22 Kyocera Corp 半導体素子収納用パッケージ

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