JPS6217490Y2 - - Google Patents
Info
- Publication number
- JPS6217490Y2 JPS6217490Y2 JP19765383U JP19765383U JPS6217490Y2 JP S6217490 Y2 JPS6217490 Y2 JP S6217490Y2 JP 19765383 U JP19765383 U JP 19765383U JP 19765383 U JP19765383 U JP 19765383U JP S6217490 Y2 JPS6217490 Y2 JP S6217490Y2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- plated
- stem
- plating jig
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 67
- 239000004020 conductor Substances 0.000 claims description 15
- 239000004065 semiconductor Substances 0.000 claims description 10
- 239000011810 insulating material Substances 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 8
- 239000011521 glass Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 7
- 229910052737 gold Inorganic materials 0.000 description 7
- 239000010931 gold Substances 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- CBVWMGCJNPPAAR-HJWRWDBZSA-N (nz)-n-(5-methylheptan-3-ylidene)hydroxylamine Chemical compound CCC(C)C\C(CC)=N/O CBVWMGCJNPPAAR-HJWRWDBZSA-N 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19765383U JPS60105660U (ja) | 1983-12-21 | 1983-12-21 | 部分メツキ治具 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19765383U JPS60105660U (ja) | 1983-12-21 | 1983-12-21 | 部分メツキ治具 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60105660U JPS60105660U (ja) | 1985-07-18 |
| JPS6217490Y2 true JPS6217490Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1987-05-06 |
Family
ID=30756062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19765383U Granted JPS60105660U (ja) | 1983-12-21 | 1983-12-21 | 部分メツキ治具 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60105660U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
-
1983
- 1983-12-21 JP JP19765383U patent/JPS60105660U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60105660U (ja) | 1985-07-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0653390A (ja) | 半導体装置及びその製造方法 | |
| JPS60163447A (ja) | 半導体素子 | |
| US4780098A (en) | Conductive lead arrangement | |
| US10163762B2 (en) | Lead frame with conductive clip for mounting a semiconductor die with reduced clip shifting | |
| US2771561A (en) | Quartz crystal units | |
| JPS62202548A (ja) | 半導体装置 | |
| JPS6217490Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
| US3092893A (en) | Fabrication of semiconductor devices | |
| US3065525A (en) | Method and device for making connections in transistors | |
| KR900001275B1 (ko) | 세라믹형 반도체 패케이지와 그의 제조방법 | |
| US3936928A (en) | Method for providing mounting assemblies for a plurality of transistor integrated circuit chips | |
| US3153275A (en) | Self-jigging method of making semiconductor devices | |
| JPS5834951A (ja) | ダブルヒ−トシンク形半導体装置の製造方法 | |
| JPH083018Y2 (ja) | 半導体パッケージ用連結型リードフレーム | |
| CN217588851U (zh) | 用于igbt模块信号端子的固定工装 | |
| JPH0766321A (ja) | 半導体装置用パッケージの電解めっき方法とそれに用いるめっき治具 | |
| JPS62173751A (ja) | ダイオ−ドブリツジ整流器 | |
| JPH0526765Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
| JPH036027Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
| JPH0614437A (ja) | バスダクト装置 | |
| JPH01302753A (ja) | 樹脂封止型半導体装置 | |
| JPH0290540A (ja) | 半導体装置 | |
| JP2726523B2 (ja) | リードフレーム及びそれを用いた半導体装置 | |
| JP2554741Y2 (ja) | 電気接続体 | |
| JPS57138164A (en) | Insulation type semiconductor device |