JPS62174248U - - Google Patents

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Publication number
JPS62174248U
JPS62174248U JP6304586U JP6304586U JPS62174248U JP S62174248 U JPS62174248 U JP S62174248U JP 6304586 U JP6304586 U JP 6304586U JP 6304586 U JP6304586 U JP 6304586U JP S62174248 U JPS62174248 U JP S62174248U
Authority
JP
Japan
Prior art keywords
container
wiring board
fixed
sensor chip
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6304586U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6304586U priority Critical patent/JPS62174248U/ja
Publication of JPS62174248U publication Critical patent/JPS62174248U/ja
Pending legal-status Critical Current

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  • Measuring Fluid Pressure (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例の要部断面図、第２
図は従来の半導体圧力センサの要部断面図、第３
図は配線基板とセンサチツプの位置ずれの説明図
、第４図は本考案による金属スペーサの種々の実
施例を示す平面図である。 １：容器ステム、２：感圧センサチツプ、５：
配線基板、６：金属スペーサ、７：はんだ。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体からなる感圧センサチツプと該センサチ
    ツプの信号処理回路が搭載された配線基板とが同
    一容器内に収容され、センサチツプが容器を貫通
    する導圧管上に、配線基板が容器底板上に固定さ
    れるものにおいて、配線基板と容器底板の間に熱
    膨張係数が基板と容器の材料の中間にある金属か
    らなり、厚さ２．５mm以上５mm以下で輪郭ほぼ角
    形のスペーサが固着されたことを特徴とする半導
    体圧力センサ。
JP6304586U 1986-04-25 1986-04-25 Pending JPS62174248U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6304586U JPS62174248U (ja) 1986-04-25 1986-04-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6304586U JPS62174248U (ja) 1986-04-25 1986-04-25

Publications (1)

Publication Number Publication Date
JPS62174248U true JPS62174248U (ja) 1987-11-05

Family

ID=30897904

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6304586U Pending JPS62174248U (ja) 1986-04-25 1986-04-25

Country Status (1)

Country Link
JP (1) JPS62174248U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02161328A (ja) * 1988-07-22 1990-06-21 Endress & Hauser Gmbh & Co 圧力センサー及びその製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS598379A (ja) * 1982-07-06 1984-01-17 Toshiba Corp 半導体圧力センサの製造方法
JPS59174728A (ja) * 1983-03-25 1984-10-03 Fuji Electric Co Ltd 半導体式圧力センサ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS598379A (ja) * 1982-07-06 1984-01-17 Toshiba Corp 半導体圧力センサの製造方法
JPS59174728A (ja) * 1983-03-25 1984-10-03 Fuji Electric Co Ltd 半導体式圧力センサ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02161328A (ja) * 1988-07-22 1990-06-21 Endress & Hauser Gmbh & Co 圧力センサー及びその製造方法

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