JPS6217181U - - Google Patents
Info
- Publication number
- JPS6217181U JPS6217181U JP10685485U JP10685485U JPS6217181U JP S6217181 U JPS6217181 U JP S6217181U JP 10685485 U JP10685485 U JP 10685485U JP 10685485 U JP10685485 U JP 10685485U JP S6217181 U JPS6217181 U JP S6217181U
- Authority
- JP
- Japan
- Prior art keywords
- conductive pattern
- circuit board
- integrated circuit
- hybrid integrated
- coating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011247 coating layer Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10685485U JPS6217181U (en:Method) | 1985-07-15 | 1985-07-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10685485U JPS6217181U (en:Method) | 1985-07-15 | 1985-07-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6217181U true JPS6217181U (en:Method) | 1987-02-02 |
Family
ID=30982599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10685485U Pending JPS6217181U (en:Method) | 1985-07-15 | 1985-07-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6217181U (en:Method) |
-
1985
- 1985-07-15 JP JP10685485U patent/JPS6217181U/ja active Pending
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