JPS6217153U - - Google Patents
Info
- Publication number
- JPS6217153U JPS6217153U JP10802085U JP10802085U JPS6217153U JP S6217153 U JPS6217153 U JP S6217153U JP 10802085 U JP10802085 U JP 10802085U JP 10802085 U JP10802085 U JP 10802085U JP S6217153 U JPS6217153 U JP S6217153U
- Authority
- JP
- Japan
- Prior art keywords
- cap member
- mentioned
- chip carrier
- pellet
- pellets
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000008188 pellet Substances 0.000 claims description 5
- 239000006258 conductive agent Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例を示す概略図、第２
図ａ乃至ｄは本考案の他の実施例を示す概略図、
第３図は本考案における平板シーラーの作成方法
を例示する図、第４図は従来のＩＣパツケージを
示す概略図である。
１…チツプキヤリヤ、２…キヤツプ部材、３…
ＩＣペレツト、４１…平板シーラー、４２…異方
性導電膜枠。
Figure 1 is a schematic diagram showing one embodiment of the present invention;
Figures a to d are schematic diagrams showing other embodiments of the present invention;
FIG. 3 is a diagram illustrating a method for producing a flat plate sealer according to the present invention, and FIG. 4 is a schematic diagram showing a conventional IC package. 1... Chip carrier, 2... Cap member, 3...
IC pellet, 41... flat plate sealer, 42... anisotropic conductive film frame.
Claims (1)
プキヤリヤ上に該ＩＣペレツト等を収納保護する
キヤツプ部材を配置し、該キヤツプ部材及びＩＣ
チツプキヤリヤ上には上記ＩＣペレツト等の所定
回路部品を配設し、上記キヤツプ部材とＩＣチツ
プキヤリヤとの周囲は異方性導電剤を以て、接着
しかつ上記ＩＣペレツト等と各回路部品等との電
気接続を施したことを特徴とするＩＣパツケージ
。 (2) 前記キヤツプ部材がキヤツプ状シーラーか
ら成ることを特徴とする実用新案登録請求の範囲
第１項記載のＩＣパツケージ。 (3) 前記キヤツプ部材が平板シーラーと、異方
性導電膜枠とから成ることを特徴とする実用新案
登録請求の範囲第１項記載のＩＣパツケージ。[Scope of Claim for Utility Model Registration] (1) A cap member for storing and protecting the IC pellet, etc. is arranged on an IC chip carrier on which the IC pellet, etc. is disposed, and the cap member and the IC
Predetermined circuit components such as the above-mentioned IC pellets are arranged on the chip carrier, and the peripheries of the above-mentioned cap member and the IC chip carrier are adhered using an anisotropic conductive agent, and electrical connections between the above-mentioned IC pellets and other circuit components are established. An IC package cage characterized by having been given. (2) The IC package according to claim 1, wherein the cap member is made of a cap-shaped sealer. (3) The IC package according to claim 1, wherein the cap member comprises a flat sealer and an anisotropic conductive film frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985108020U JPH0514517Y2 (en) | 1985-07-15 | 1985-07-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985108020U JPH0514517Y2 (en) | 1985-07-15 | 1985-07-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6217153U true JPS6217153U (en) | 1987-02-02 |
| JPH0514517Y2 JPH0514517Y2 (en) | 1993-04-19 |
Family
ID=30984828
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985108020U Expired - Lifetime JPH0514517Y2 (en) | 1985-07-15 | 1985-07-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0514517Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5764953A (en) * | 1980-10-09 | 1982-04-20 | Oki Electric Ind Co Ltd | Semiconductor device |
-
1985
- 1985-07-15 JP JP1985108020U patent/JPH0514517Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5764953A (en) * | 1980-10-09 | 1982-04-20 | Oki Electric Ind Co Ltd | Semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0514517Y2 (en) | 1993-04-19 |
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