JPS5856453U - IC package with built-in bypass capacitor - Google Patents

IC package with built-in bypass capacitor

Info

Publication number
JPS5856453U
JPS5856453U JP15049981U JP15049981U JPS5856453U JP S5856453 U JPS5856453 U JP S5856453U JP 15049981 U JP15049981 U JP 15049981U JP 15049981 U JP15049981 U JP 15049981U JP S5856453 U JPS5856453 U JP S5856453U
Authority
JP
Japan
Prior art keywords
package
built
bypass capacitor
capacitor
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15049981U
Other languages
Japanese (ja)
Inventor
健造 北山
章 内田
Original Assignee
古野電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 古野電気株式会社 filed Critical 古野電気株式会社
Priority to JP15049981U priority Critical patent/JPS5856453U/en
Publication of JPS5856453U publication Critical patent/JPS5856453U/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図及び第２図はこの考案の実施例を示し、　　　　
−、１はパッケージ、２はＩＣチップ、３はピン電極、
４Ａ、４Ｂは接続用電極、５Ａ、５Ｂはコンデンサー電
極、６は誘電材を示す。Figures 1 and 2 show an embodiment of this invention,
-, 1 is the package, 2 is the IC chip, 3 is the pin electrode,
4A and 4B are connecting electrodes, 5A and 5B are capacitor electrodes, and 6 is a dielectric material.

Claims (1)

【実用新案登録請求の範囲】 、（１）ＩＣチップを固定する／七ツケージ内にコンデ
ンサーが封入され、該コンデンサーの各電極を上記ＩＣ
チップの電源端子間に接続してなるバイパスコンデンサ
ーを内蔵したＩＣパッケージ。 （２）コンデンサーの誘電材が上記パッケージ材が用い
られていることを特徴とする実用新案登録請求の範囲第
１項記載のバイパスコンデンサーを内蔵したＩＣパッケ
ージ。[Claims for Utility Model Registration] (1) Fixing an IC chip/A capacitor is sealed in a cage, and each electrode of the capacitor is connected to the IC chip.
An IC package with a built-in bypass capacitor connected between the chip's power terminals. (2) An IC package incorporating a bypass capacitor according to claim 1, wherein the above packaging material is used as the dielectric material of the capacitor.
JP15049981U 1981-10-08 1981-10-08 IC package with built-in bypass capacitor Pending JPS5856453U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15049981U JPS5856453U (en) 1981-10-08 1981-10-08 IC package with built-in bypass capacitor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15049981U JPS5856453U (en) 1981-10-08 1981-10-08 IC package with built-in bypass capacitor

Publications (1)

Publication Number Publication Date
JPS5856453U true JPS5856453U (en) 1983-04-16

Family

ID=29943221

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15049981U Pending JPS5856453U (en) 1981-10-08 1981-10-08 IC package with built-in bypass capacitor

Country Status (1)

Country Link
JP (1) JPS5856453U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6443265U (en) * 1987-09-11 1989-03-15

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS568854A (en) * 1979-07-04 1981-01-29 Mitsubishi Electric Corp Package for semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS568854A (en) * 1979-07-04 1981-01-29 Mitsubishi Electric Corp Package for semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6443265U (en) * 1987-09-11 1989-03-15

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