JPS6216750B2 - - Google Patents
Info
- Publication number
- JPS6216750B2 JPS6216750B2 JP6982280A JP6982280A JPS6216750B2 JP S6216750 B2 JPS6216750 B2 JP S6216750B2 JP 6982280 A JP6982280 A JP 6982280A JP 6982280 A JP6982280 A JP 6982280A JP S6216750 B2 JPS6216750 B2 JP S6216750B2
- Authority
- JP
- Japan
- Prior art keywords
- brazing filler
- filler metal
- melting point
- based alloy
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ceramic Products (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6982280A JPS56165591A (en) | 1980-05-26 | 1980-05-26 | Low melting point cu-mn base alloy brazing filler metal having good wetting property |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6982280A JPS56165591A (en) | 1980-05-26 | 1980-05-26 | Low melting point cu-mn base alloy brazing filler metal having good wetting property |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56165591A JPS56165591A (en) | 1981-12-19 |
| JPS6216750B2 true JPS6216750B2 (en:Method) | 1987-04-14 |
Family
ID=13413826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6982280A Granted JPS56165591A (en) | 1980-05-26 | 1980-05-26 | Low melting point cu-mn base alloy brazing filler metal having good wetting property |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56165591A (en:Method) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103358051A (zh) * | 2013-07-23 | 2013-10-23 | 华南理工大学 | 一种铜基钎料及其制备方法 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4587097A (en) * | 1984-06-22 | 1986-05-06 | Allied Corporation | Homogeneous low melting temperature brazing filler metal for joining ferrous and non-ferrous alloys |
| JPS62259696A (ja) * | 1986-05-07 | 1987-11-12 | Mitsubishi Metal Corp | 超硬合金部材と鋼部材とのろう付け用Cu合金ろう材 |
| KR20030012584A (ko) * | 2001-08-01 | 2003-02-12 | 주식회사삼화합금사 | 용가재용 합금 조성물 및 그 제조방법 |
| JP4766850B2 (ja) * | 2004-07-29 | 2011-09-07 | ダイハツ工業株式会社 | ろう材 |
| CN110936062A (zh) * | 2019-12-18 | 2020-03-31 | 陕西易莱德新材料科技有限公司 | 一种添加有铂金属的焊料及其制备方法 |
| CN117157419A (zh) * | 2021-06-28 | 2023-12-01 | 古河电气工业株式会社 | 铜合金材料以及使用其的电阻器用电阻材料及电阻器 |
-
1980
- 1980-05-26 JP JP6982280A patent/JPS56165591A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103358051A (zh) * | 2013-07-23 | 2013-10-23 | 华南理工大学 | 一种铜基钎料及其制备方法 |
| CN103358051B (zh) * | 2013-07-23 | 2015-08-26 | 华南理工大学 | 一种铜基钎料及其制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56165591A (en) | 1981-12-19 |
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