JPS6216750B2 - - Google Patents

Description

[Detailed description of the invention]

This invention has good wettability and low melting point
This relates to Cu-Mn based alloy brazing filler metal. Conventionally, in the manufacture of bits for drilling, rock drilling, or cutting, when soldering chips made of cemented carbide (e.g., WC-Co-based alloy) to base metals (steel materials), Cu-Mn-based chips were mainly used. Alloy brazing filler metal and silver soldering material are used. Particularly recently, the above-mentioned Cu-Mn-based alloy brazing filler metal has attracted attention as a new brazing filler metal to replace silver solder, and has come to be widely used. It can also be used for fluxless soldering in an inert gas atmosphere. (b) It is cheaper than silver solder. (c) High brazing shear strength can be obtained. (d) It has good plastic workability, so it can be easily processed into thin wires and thin plates. For example, in rock drilling bits manufactured using the Cu-Mn-based alloy brazing material, the drilling life is shortened due to the soldering part. This is determined not by chip loss, but by chip wear. As described above, Cu-Mn-based alloy brazing filler metal has excellent properties, so it can be used not only for brazing cemented carbide but also for brazing cemented carbide.
Attempts have also been made to use silver solder instead of silver solder in the field of soldering, such as electrical equipment and decorative items, where silver solder has traditionally been mainly used. When the object to be soldered is an electrical component, the electrical resistance of the brazing material itself is large, so that Joule heat is generated in the soldered part. (b) In particular, the melting point is higher than that of silver solder containing Cd, so the soldering workability is poor. Due to these problems, it is currently impossible to completely replace silver solder in the fields in which it is used. Therefore, from the above-mentioned viewpoint, the present inventors have conducted research to solve the problems that appear when Cu-Mn-based alloy brazing filler metal is used in the field of silver soldering. Mn-based alloy brazing filler metal, Ag
When containing, the electrical resistance value becomes low and
The wettability is significantly improved and the melting point is lowered, and when B and Li are added, the castability is improved when producing a brazing filler metal, and wax oxidation is suppressed during soldering. In addition, we have obtained the knowledge that oxides on the surface of the soldering base metal are forcibly reduced, and the dissolution of gas into the molten solder during soldering work is significantly suppressed. be. This invention was made based on the above knowledge, and contains Mn: 7.5 to 45%, Zn: 0.1 to 25%, Ni, Fe, and Co in weight% (hereinafter % indicates weight%). One or more of these: 1 to 15%, Ag: 0.1 to 25%, One or two of B and Li: 0.001 to
0.8%, and further contains either or both of Al: 0.05 to 3%, rare earth elements: 0.005 to 0.3%, and the rest is
It is a Cu-Mn-based alloy brazing material that has a composition consisting of Cu and unavoidable impurities, and has excellent wettability and a low melting point. Next, the reason for limiting the component composition range as described above in the brazing material of the present invention will be explained. (a) Mn The Mn component has the effect of lowering the melting point of the brazing filler metal, but if its content is less than 7.5%, the melting point of the brazing filler metal will exceed 1000℃, resulting in poor soldering workability. On the other hand, if the Mn content exceeds 45%, melting workability becomes difficult during the manufacture of the brazing filler metal, the Mn yield becomes extremely poor, and the melting point of the brazing filler metal once again exceeds 1000°C. , its content was determined to be 7.5-45%. (b) Zn The Zn component lowers the melting point of the brazing filler metal and
It not only reduces the solubility of gas in the molten solder during soldering work, improves the fluidity and wettability of the solder, but also prevents the oxidation of the molten solder, but its content is 0.1%. If the content is less than 25%, the desired effect cannot be obtained; on the other hand, if the content exceeds 25%, the workability in processes such as rolling or wire drawing used in the manufacture of brazing metal will decrease, and the brazing process will be impaired. At times, Zn evaporation becomes intense and defects are more likely to occur in the soldered joints, so the content should be reduced to 0.1 to 25%.
It was determined that (c) Ni, Fe, and Co These components have the uniform effect of improving heat resistance and corrosion resistance without reducing the ductility of the brazing filler metal, but if their content is less than 1%, the desired effect may not be achieved. On the other hand, if the content exceeds 15%, the melting point of the brazing filler metal will exceed 1000℃, which will reduce the soldering workability. It was set at 15%. (d) Ag The Ag component lowers the electrical resistance of the brazing filler metal,
It has the effect of improving the electrical conductivity of the brazed joint, improving the wettability of the solder, and lowering the melting point of the brazing material, but if the content is less than 0.1%, the desired effect will not be achieved. Not obtained, while 25%
Even if the content exceeds 0.1%, no further improvement effect will be obtained due to the above-mentioned action, and in consideration of economic efficiency, the content was set at 0.1 to 25%. (e) Al The Al component has the effect of improving the oxidation resistance of the solder during soldering, as well as solid solution strengthening and slight precipitation strengthening, so it particularly requires better oxidation resistance and high strength. If the content is less than 0.01%, the desired improvement effect will not appear, while if the content exceeds 3%, the brazing filler metal itself will become brittle and the workability will deteriorate. Since it will deteriorate, the content should be reduced to 0.01 to 3.
%. (f) B and Li These components include:
It further improves castability, and when soldering,
It has the uniform effect of preventing solder oxidation, forcibly reducing oxides on the surface of the soldering base metal, and significantly suppressing the dissolution of gas into the molten solder during soldering work, but its content is 0.001 If it is less than 0.8%, the desired improvement effect cannot be obtained.
If the content exceeds 0.001% to 0.8%, the brazing filler metal itself becomes brittle and its workability deteriorates, so the content was set at 0.001% to 0.8%. (g) Rare earth elements Rare earth elements have the effect of preventing the oxidation of the solder during heating during soldering and further improving the wettability of the solder, so better oxidation resistance and wettability are required. If the content is less than 0.005%, the desired effect of improving the above action cannot be obtained, while if the content exceeds 0.3%, dissolution during the production of the brazing material may be reduced. This is not only difficult but also increases the possibility of defects in the ingot, so the content should be reduced to 0.005 to 0.3.
%. Next, the brazing filler metal of the present invention will be explained using examples and comparing with comparative examples. EXAMPLE A molten metal having the composition shown in Table 1 was prepared by an ordinary melting method, cast, rolled under ordinary conditions, and wire-drawn. Comparative brazing filler metals 1 to 5 were each produced. Note that all of the comparative brazing filler metals 1 to 5 have compositions that do not contain Ag. Next, the above-mentioned brazing fillers 1 to 15 of the present invention and comparison brazing fillers 1 to 5 were subjected to a solder spreading test using flux at the brazing temperatures shown in Table 1 in accordance with JIS Z3191. The spread area of the wax on each SS41 board was measured.
These measurement results are also shown in Table 1. Table 1 also shows the electrical conductivity of the brazing filler metal. As shown in Table 1, the present invention brazing materials 1 to 15
It is clear that both have superior wettability and good electrical conductivity compared to comparative brazing filler metals that do not contain Ag, B, or Li.

[Table] As mentioned above, the Cu-Mn-based alloy brazing material of the present invention has a low melting point and good wettability, so it can be soldered with good workability at a low soldering temperature, and Because of its low electrical resistance, it has industrially useful properties, such as being able to be used in place of silver solder in the fields of soldering, such as electrical equipment and decorative items, where silver solder has traditionally been used.

Claims (1)

[Claims] 1 Mn: 7.5-45%, Zn: 0.1-25%, one or more of Ni, Fe, and Co: 1-15%, Ag: 0.1-25%, B and one or two of Li: 0.001~
A low melting point Cu-Mn based alloy brazing filler metal having good wettability, characterized in that it contains 0.8% and the rest consists of Cu and unavoidable impurities (weight% or more). 2 Mn: 7.5 to 45%, Zn: 0.1 to 25%, one or more of Ni, Fe, and Co: 1 to 15%, Ag: 0.1 to 25%, one of B and Li Species or 2 types: 0.001~
0.8%, and further contains Al: 0.01 to 3%, and the remainder is Cu and unavoidable impurities (weight %). Low melting point Cu with good wettability -Mn-based alloy brazing filler metal. 3 Mn: 7.5 to 45%, Zn: 0.1 to 25%, one or more of Ni, Fe, and Co: 1 to 15%, Ag: 0.1 to 25%, one of B and Li Species or 2 types: 0.001~
A low melting point product with good wettability characterized by having a composition (more than % by weight) containing 0.8% and further containing rare earth elements: 0.005 to 0.3%, with the remainder consisting of Cu and unavoidable impurities. Cu-Mn based alloy brazing filler metal. 4 Mn: 7.5 to 45%, Zn: 0.1 to 25%, one or more of Ni, Fe, and Co: 1 to 15%, Ag: 0.01 to 3%, one of B and Li Species or 2 types: 0.001~
0.8%, and further contains Al: 0.01 to 3%, rare earth elements: 0.005 to 0.3%, and the remainder is Cu and unavoidable impurities (weight %). A low melting point Cu-Mn based alloy brazing filler metal with good wettability.