JPS62167176U - - Google Patents
Info
- Publication number
- JPS62167176U JPS62167176U JP5569186U JP5569186U JPS62167176U JP S62167176 U JPS62167176 U JP S62167176U JP 5569186 U JP5569186 U JP 5569186U JP 5569186 U JP5569186 U JP 5569186U JP S62167176 U JPS62167176 U JP S62167176U
- Authority
- JP
- Japan
- Prior art keywords
- tab
- electrode
- printed circuit
- circuit board
- smaller
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005530 etching Methods 0.000 claims 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Description
第1図は本考案のTAB―IC試験治具の模式
的部分縦断面図、第2図はTAB―ICの一例の
平面図である。第3図は実施例におけるプリント
基板、異方導電性シートTAB―IC、押圧板が
位置合わせされる様子を示す。第4図は本考案の
他の実施例を示す部分断面図である。
FIG. 1 is a schematic partial vertical sectional view of the TAB-IC test jig of the present invention, and FIG. 2 is a plan view of an example of the TAB-IC. FIG. 3 shows how the printed circuit board, anisotropically conductive sheet TAB-IC, and press plate are aligned in the example. FIG. 4 is a partial sectional view showing another embodiment of the present invention.
Claims (1)
してプリント基板上に載せ、タブICの電極パツ
ドと同等もしくはより小さいパターンを凸状部と
して下面に有する板材をタブIC上に対向させて
積載し、プリント基板の下面および板材の上面を
それぞれ剛性盤体で挾持して加圧し、該ICのI
/O電極と該プリント基板のパターン電極を電気
的に接続するようにしたことを特徴とするタブI
C電極用治具。 2 タブICの電極パツドと同等もしくは、より
小さいパターンを凸状部として有する板材が、銅
張積層板をエツチングして作られたものであるこ
とを特徴とする実用新案登録請求の範囲第1項記
載のタブIC試験用治具。[Claims for Utility Model Registration] 1. A tab IC is mounted on a printed circuit board directly or via an anisotropic conductive sheet, and a plate material having a convex pattern on the lower surface that is equal to or smaller than the electrode pad of the tab IC is called a tab. The lower surface of the printed circuit board and the upper surface of the board are each held between rigid boards and pressure is applied.
A tab I characterized in that the /O electrode and the pattern electrode of the printed circuit board are electrically connected.
Jig for C electrode. 2. Scope of Utility Model Registration Claim 1, characterized in that the plate material having a convex pattern that is equal to or smaller than the electrode pad of a tab IC is made by etching a copper-clad laminate. Tab IC test jig as described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986055691U JPH0518708Y2 (en) | 1986-04-14 | 1986-04-14 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986055691U JPH0518708Y2 (en) | 1986-04-14 | 1986-04-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62167176U true JPS62167176U (en) | 1987-10-23 |
JPH0518708Y2 JPH0518708Y2 (en) | 1993-05-18 |
Family
ID=30883824
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986055691U Expired - Lifetime JPH0518708Y2 (en) | 1986-04-14 | 1986-04-14 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0518708Y2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01161170A (en) * | 1987-12-18 | 1989-06-23 | Japan Synthetic Rubber Co Ltd | Testing device for integrated circuit component |
JPH02156168A (en) * | 1988-12-07 | 1990-06-15 | Nec Corp | Screening apparatus |
JPH02148483U (en) * | 1989-05-19 | 1990-12-17 | ||
JPH07113840A (en) * | 1993-09-21 | 1995-05-02 | Micron Technol Inc | Carrier having replaceable substrate used in test of semiconductor die |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS601574A (en) * | 1983-06-20 | 1985-01-07 | Ibiden Co Ltd | Jig circuit board for inspection of printed circuit board |
-
1986
- 1986-04-14 JP JP1986055691U patent/JPH0518708Y2/ja not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS601574A (en) * | 1983-06-20 | 1985-01-07 | Ibiden Co Ltd | Jig circuit board for inspection of printed circuit board |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01161170A (en) * | 1987-12-18 | 1989-06-23 | Japan Synthetic Rubber Co Ltd | Testing device for integrated circuit component |
JPH02156168A (en) * | 1988-12-07 | 1990-06-15 | Nec Corp | Screening apparatus |
JPH02148483U (en) * | 1989-05-19 | 1990-12-17 | ||
JPH07113840A (en) * | 1993-09-21 | 1995-05-02 | Micron Technol Inc | Carrier having replaceable substrate used in test of semiconductor die |
Also Published As
Publication number | Publication date |
---|---|
JPH0518708Y2 (en) | 1993-05-18 |
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