JPS6216551B2 - - Google Patents
Info
- Publication number
- JPS6216551B2 JPS6216551B2 JP13782578A JP13782578A JPS6216551B2 JP S6216551 B2 JPS6216551 B2 JP S6216551B2 JP 13782578 A JP13782578 A JP 13782578A JP 13782578 A JP13782578 A JP 13782578A JP S6216551 B2 JPS6216551 B2 JP S6216551B2
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- copper
- lead
- chip
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W72/00—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13782578A JPS5565452A (en) | 1978-11-10 | 1978-11-10 | Slug lead |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13782578A JPS5565452A (en) | 1978-11-10 | 1978-11-10 | Slug lead |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5565452A JPS5565452A (en) | 1980-05-16 |
| JPS6216551B2 true JPS6216551B2 (OSRAM) | 1987-04-13 |
Family
ID=15207721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13782578A Granted JPS5565452A (en) | 1978-11-10 | 1978-11-10 | Slug lead |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5565452A (OSRAM) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS588959U (ja) * | 1981-07-13 | 1983-01-20 | 日本電気ホームエレクトロニクス株式会社 | Dhd形ダイオ−ド |
-
1978
- 1978-11-10 JP JP13782578A patent/JPS5565452A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5565452A (en) | 1980-05-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6018275B2 (ja) | 抵抗溶接用電極とその製法 | |
| JP2001511072A (ja) | 半田ごてのチップ及びその製造方法 | |
| JPS6216551B2 (OSRAM) | ||
| US4504427A (en) | Solder preform stabilization for lead frames | |
| JP3455126B2 (ja) | ワイヤボンデイング方法 | |
| US4943687A (en) | Current collecting unit | |
| JPH035665B2 (OSRAM) | ||
| JPS5929349A (ja) | せん光管およびその製造方法 | |
| EP0348018A2 (en) | Resin encapsulated semiconductor device and method of manufacture thereof | |
| JPS6210019B2 (OSRAM) | ||
| JPS5816615B2 (ja) | 半導体装置の製造方法 | |
| JPS61156757A (ja) | 半導体装置 | |
| JP2506152B2 (ja) | 被覆線のワイヤボンディング方法 | |
| JPS637027B2 (OSRAM) | ||
| JPH06104027A (ja) | 圧着用スリーブ材および接続体 | |
| JPS622771Y2 (OSRAM) | ||
| JP2001225162A (ja) | ろう付け接合方法 | |
| JP2914578B2 (ja) | 半導体素子用ボンディング線 | |
| JPS61199645A (ja) | ワイヤボンデイング用ボ−ルの形成方法 | |
| JPS6222701B2 (OSRAM) | ||
| JPS6245137A (ja) | 電子部品およびその製造方法 | |
| JPH0571038B2 (OSRAM) | ||
| JPH02256187A (ja) | 点火プラグの複合接地電極及びその製造方法 | |
| JPS60193287A (ja) | 通電用端末 | |
| JPS63217633A (ja) | ワイヤボンデイング方法 |