JPS62163933U - - Google Patents
Info
- Publication number
- JPS62163933U JPS62163933U JP5250586U JP5250586U JPS62163933U JP S62163933 U JPS62163933 U JP S62163933U JP 5250586 U JP5250586 U JP 5250586U JP 5250586 U JP5250586 U JP 5250586U JP S62163933 U JPS62163933 U JP S62163933U
- Authority
- JP
- Japan
- Prior art keywords
- lamp
- semiconductor wafer
- heating device
- light source
- source lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 230000001678 irradiating effect Effects 0.000 claims 1
- 238000001816 cooling Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Description
第1図は本考案の一実施例の概略断面図、第2
図は従来装置の概略断面図である。
1…装置本体、2…反応管、3…ガス導入管、
5…ランプ、6…反射板、7…水冷装置、8…ウ
エハ載置台、8a…蓋部、9…蓋体、10,11
,17,18…Oリング、12…ボルト、13…
枝管、14…放射温度計。
Fig. 1 is a schematic sectional view of one embodiment of the present invention;
The figure is a schematic cross-sectional view of a conventional device. 1... Apparatus main body, 2... Reaction tube, 3... Gas introduction tube,
5... Lamp, 6... Reflector, 7... Water cooling device, 8... Wafer mounting table, 8a... Lid, 9... Lid, 10, 11
, 17, 18...O ring, 12...bolt, 13...
Branch pipe, 14... Radiation thermometer.
Claims (1)
温し、加熱処理を行うランプ加熱装置において、
半導体ウエハを設置する反応管内は、光源ランプ
の設けられている空間及び外気とは遮断されるこ
とを特徴とするランプ加熱装置。 In a lamp heating device that heats a semiconductor wafer by irradiating it with light from a light source lamp,
A lamp heating device characterized in that the interior of a reaction tube in which a semiconductor wafer is placed is isolated from a space in which a light source lamp is provided and from the outside air.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5250586U JPS62163933U (en) | 1986-04-08 | 1986-04-08 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5250586U JPS62163933U (en) | 1986-04-08 | 1986-04-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62163933U true JPS62163933U (en) | 1987-10-17 |
Family
ID=30877730
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5250586U Pending JPS62163933U (en) | 1986-04-08 | 1986-04-08 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62163933U (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60133719A (en) * | 1983-12-21 | 1985-07-16 | Seiko Epson Corp | Manufacture of compound semiconductor device |
JPS60253939A (en) * | 1984-05-31 | 1985-12-14 | Fujitsu Ltd | Measuring method of substrate temperature |
-
1986
- 1986-04-08 JP JP5250586U patent/JPS62163933U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60133719A (en) * | 1983-12-21 | 1985-07-16 | Seiko Epson Corp | Manufacture of compound semiconductor device |
JPS60253939A (en) * | 1984-05-31 | 1985-12-14 | Fujitsu Ltd | Measuring method of substrate temperature |
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