JPS6215845A - リ−ドフレ−ムの製造方法 - Google Patents

リ−ドフレ−ムの製造方法

Info

Publication number
JPS6215845A
JPS6215845A JP15447385A JP15447385A JPS6215845A JP S6215845 A JPS6215845 A JP S6215845A JP 15447385 A JP15447385 A JP 15447385A JP 15447385 A JP15447385 A JP 15447385A JP S6215845 A JPS6215845 A JP S6215845A
Authority
JP
Japan
Prior art keywords
hole
recess
stage
punch
recess part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15447385A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0149023B2 (enrdf_load_stackoverflow
Inventor
Teruo Saito
輝夫 斎藤
Sugio Uchida
内田　杉雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP15447385A priority Critical patent/JPS6215845A/ja
Publication of JPS6215845A publication Critical patent/JPS6215845A/ja
Publication of JPH0149023B2 publication Critical patent/JPH0149023B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP15447385A 1985-07-12 1985-07-12 リ−ドフレ−ムの製造方法 Granted JPS6215845A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15447385A JPS6215845A (ja) 1985-07-12 1985-07-12 リ−ドフレ−ムの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15447385A JPS6215845A (ja) 1985-07-12 1985-07-12 リ−ドフレ−ムの製造方法

Publications (2)

Publication Number Publication Date
JPS6215845A true JPS6215845A (ja) 1987-01-24
JPH0149023B2 JPH0149023B2 (enrdf_load_stackoverflow) 1989-10-23

Family

ID=15585017

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15447385A Granted JPS6215845A (ja) 1985-07-12 1985-07-12 リ−ドフレ−ムの製造方法

Country Status (1)

Country Link
JP (1) JPS6215845A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63224245A (ja) * 1987-03-13 1988-09-19 Hitachi Ltd リ−ドフレ−ム並びに半導体装置
JPH03125466A (ja) * 1989-10-09 1991-05-28 Hitachi Cable Ltd リードフレーム用溝成形加工法
US5371943A (en) * 1991-10-29 1994-12-13 Rohm Co., Ltd. Method of making a lead frame
EP1073116A3 (en) * 1999-07-09 2002-03-27 Shinko Electric Industries Co. Ltd. Lead frame and semiconductor device
USRE37690E1 (en) 1987-02-25 2002-05-07 Hitachi, Ltd. Lead frame and semiconductor device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE37690E1 (en) 1987-02-25 2002-05-07 Hitachi, Ltd. Lead frame and semiconductor device
JPS63224245A (ja) * 1987-03-13 1988-09-19 Hitachi Ltd リ−ドフレ−ム並びに半導体装置
JPH03125466A (ja) * 1989-10-09 1991-05-28 Hitachi Cable Ltd リードフレーム用溝成形加工法
US5371943A (en) * 1991-10-29 1994-12-13 Rohm Co., Ltd. Method of making a lead frame
US5521430A (en) * 1991-10-29 1996-05-28 Rohm Co., Ltd. Semiconductor apparatus and its manufacturing method
EP1073116A3 (en) * 1999-07-09 2002-03-27 Shinko Electric Industries Co. Ltd. Lead frame and semiconductor device

Also Published As

Publication number Publication date
JPH0149023B2 (enrdf_load_stackoverflow) 1989-10-23

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