JPS62158390A - Electronic circuit device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a composite electronic circuit device in which a hybrid integrated circuit is mounted on a motherboard.

[Technical background of the invention and its problems] In recent years, hybrid integrated circuits using thick film circuits have been widely used as electronic devices become smaller and lighter.

The thick film circuit used in this hybrid integrated circuit is generally manufactured as follows.

That is, as shown in FIG. 3, first, a conductor paste containing, for example, silver palladium (Aa/Pd) powder is printed and fired on an insulating substrate 1 made of a ceramic material such as alumina to form a lower conductor layer 2 and terminals. Mounting pad 2
form a. At this time, the required number of terminal mounting pads 2a are formed in a line on one side of the substrate. Next, insulating paste is printed on the required locations and fired to form the insulating layer 3.
A resistor layer 4 is formed by printing and firing a resistor paste containing ruthenium oxide (Ru 02 ) powder thereon. Roughly, a conductor paste containing silver palladium powder is printed and fired to form the upper conductor layer 5, a protective coat is provided on top of it, the resistance value is adjusted with a laser trimmer, and the terminal is attached to the terminal mounting pad 2a to complete the process. do.

The hybrid integrated circuit is constructed by soldering chip-type passive elements, which usually have no lead wires, to the thick film circuit 6. When mounting this on a motherboard, as shown in FIG. Terminal mounting land 7 in the through hole of the board 7
a, 7a...7a are provided and a hybrid integrated circuit 8 is provided in this through hole.
Insert the terminal 8a connected to the terminal mounting pad 2a of
Roughly in the same manner, lands 7b are formed in the through holes of the motherboard 7, and the terminals 9a of the discrete components (components with leads) 9 are inserted into these through holes and soldered.

However, in such a conventional circuit configuration, it is necessary to route the circuit pattern from the component land 7b to the land 8a in order to attach the terminal of the hybrid integrated circuit 8, and in addition, since the terminal attachment land 7a is provided on the motherboard 7, There was a problem in that other discrete components etc. could not be attached to the periphery, making it difficult to perform high-density mounting.

[Object of the Invention] The present invention was made to solve such problems, and it is not necessary to provide a terminal mounting land for connecting the terminals of the hybrid integrated circuit to the motherboard, thus improving the packaging density. The purpose of the present invention is to provide an electronic circuit device that can perform the following steps.

[Summary of the Invention] In other words, in the electronic circuit device of the present invention, discrete components are soldered to one surface of a motherboard by passing their terminals through the motherboard, and a hybrid integrated circuit is soldered to the other surface of the motherboard. The solder is fixed to the terminal of the discrete component protruding from the terminal and is electrically connected to the motherboard through this terminal, thereby providing a terminal mounting land for connecting the terminal of the hybrid integrated circuit to the motherboard. This eliminates the need for this, thereby improving packaging density.

In the present invention, by arranging the terminal attachment portions of the hybrid integrated circuit board as many times as possible over a wide range, the degree of freedom in circuit design can be increased and higher density can be achieved.

[Embodiments of the invention] Next, embodiments of the present invention will be described with reference to the drawings.

In the hybrid integrated circuit of this embodiment, as shown in FIG. 1, a lower conductor layer 12 including randomly arranged terminal mounting pads 12a is formed on an insulating substrate 11 made of alumina or the like by printing and firing, and then forming an insulator layer 13, a resistor layer 14, an upper conductor layer 15, and a protective coat in this order;
It is formed by mounting leadless components (not shown) on a thick film circuit 16 whose resistance value is adjusted using a laser trimmer or the like. A through hole 21 is formed in the terminal mounting pad 12a of the hybrid integrated circuit 17. Then, as shown in FIG. 2, the parts of the terminals 20 of the discrete component 19, which have been passed through the mother board 18 in advance, protruding from the mother board are passed through the through holes 21 and soldered to the hybrid integrated circuit 17. is attached to the mother board 18. Here, it is not necessary to solder all the terminals; it is sufficient to perform soldering only on those that require soldering, and simply insert the terminals into the through holes.

Note that among the terminals 20 extending through the motherboard of the discrete component 19, those that are unnecessary for mounting the hybrid integrated circuit are cut off before mounting the hybrid integrated circuit 19.

In this way, in the present invention, it is not necessary to route the line pattern to the terminal mounting position in the hybrid integrated circuit, and the land for attaching the hybrid integrated circuit 17 to the mother board 18 is not required, so that only that part can be connected to other parts. can be placed inside the motherboard, and the overall density can be increased.

[Effects of the Invention] As explained above, according to the present invention, it becomes unnecessary to route the circuit pattern of the hybrid integrated circuit on the motherboard, and therefore the entire circuit can be made more dense. In addition, on the motherboard, other parts can be attached to the place where the hybrid integrated circuit was attached, and the overall density can be increased.

[Brief Description of the Drawings] Fig. 1 is a plan view of a hybrid integrated circuit according to the present invention, Fig. 2 is a sectional view schematically showing the device of the present invention, and Fig. 3 is a thick film used in a conventional hybrid integrated circuit. Plan view showing the circuit board, No. 4
The figure is a sectional view schematically showing an embodiment of the invention. 1.11...Insulating substrate 2.12...Lower conductor layer 2a, 12a
・・・Terminal mounting pad 3.13・・・・・・・・・
Insulator layer 4.14... Resistor layer 5.15... Upper conductor layer 6.16...
...Thick film circuit 7.18...Mother board 8.17...
・・・・・・Hybrid integrated circuit 9.19・・・・・・・・・
Discrete parts 20・・・・・・・・・・・・・・・
・Terminal 21 of a discrete component attached to a hybrid integrated circuit...Through-hole applicant
Toshiba Corporation Toshiba Audio/Video Engineering Co., Ltd. Agent Patent Attorney Sasu Suyama - '11) Figure 1, Section 2

Claims (1)

[Claims] (1) A discrete component is soldered to one side of the motherboard with its terminal passing through the motherboard, and a hybrid integrated circuit is fixed to the other side by soldering to the terminal of the discrete component protruding from the motherboard. An electronic circuit device characterized in that the electronic circuit device is electrically connected to the motherboard via a terminal of the discrete component.