JPS62154798A - プリント基板製造装置 - Google Patents
プリント基板製造装置Info
- Publication number
- JPS62154798A JPS62154798A JP29476585A JP29476585A JPS62154798A JP S62154798 A JPS62154798 A JP S62154798A JP 29476585 A JP29476585 A JP 29476585A JP 29476585 A JP29476585 A JP 29476585A JP S62154798 A JPS62154798 A JP S62154798A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- vibration
- carrier bar
- processing liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000012545 processing Methods 0.000 claims description 31
- 239000007788 liquid Substances 0.000 claims description 30
- 239000000725 suspension Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 2
- 230000005347 demagnetization Effects 0.000 claims 1
- 230000005284 excitation Effects 0.000 claims 1
- 238000007747 plating Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 6
- 230000007547 defect Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000011282 treatment Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000007781 pre-processing Methods 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 235000011962 puddings Nutrition 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29476585A JPS62154798A (ja) | 1985-12-27 | 1985-12-27 | プリント基板製造装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29476585A JPS62154798A (ja) | 1985-12-27 | 1985-12-27 | プリント基板製造装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62154798A true JPS62154798A (ja) | 1987-07-09 |
| JPH0362315B2 JPH0362315B2 (enrdf_load_stackoverflow) | 1991-09-25 |
Family
ID=17812007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29476585A Granted JPS62154798A (ja) | 1985-12-27 | 1985-12-27 | プリント基板製造装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62154798A (enrdf_load_stackoverflow) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0311061U (enrdf_load_stackoverflow) * | 1989-06-19 | 1991-02-01 | ||
| JPH04103195A (ja) * | 1990-08-22 | 1992-04-06 | Toppan Printing Co Ltd | 小径スルーホールプリント配線板の製造装置 |
| WO2011105072A1 (ja) * | 2010-02-24 | 2011-09-01 | 住友ベークライト株式会社 | 基板処理方法および基板処理装置 |
| JP2012082447A (ja) * | 2010-10-07 | 2012-04-26 | Sumitomo Bakelite Co Ltd | 基板処理装置および方法 |
| JP2012082448A (ja) * | 2010-10-07 | 2012-04-26 | Sumitomo Bakelite Co Ltd | 基板処理装置および方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5662998A (en) * | 1979-10-24 | 1981-05-29 | C Uyemura & Co Ltd | Surface processing method dependent upon high-speed vibration |
| JPS5818798A (ja) * | 1981-07-24 | 1983-02-03 | 株式会社日立製作所 | センサチエツク装置 |
| JPS6232690A (ja) * | 1985-08-05 | 1987-02-12 | 三菱電機株式会社 | プリント基板のめつき方法 |
-
1985
- 1985-12-27 JP JP29476585A patent/JPS62154798A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5662998A (en) * | 1979-10-24 | 1981-05-29 | C Uyemura & Co Ltd | Surface processing method dependent upon high-speed vibration |
| JPS5818798A (ja) * | 1981-07-24 | 1983-02-03 | 株式会社日立製作所 | センサチエツク装置 |
| JPS6232690A (ja) * | 1985-08-05 | 1987-02-12 | 三菱電機株式会社 | プリント基板のめつき方法 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0311061U (enrdf_load_stackoverflow) * | 1989-06-19 | 1991-02-01 | ||
| JPH04103195A (ja) * | 1990-08-22 | 1992-04-06 | Toppan Printing Co Ltd | 小径スルーホールプリント配線板の製造装置 |
| WO2011105072A1 (ja) * | 2010-02-24 | 2011-09-01 | 住友ベークライト株式会社 | 基板処理方法および基板処理装置 |
| JP2012082447A (ja) * | 2010-10-07 | 2012-04-26 | Sumitomo Bakelite Co Ltd | 基板処理装置および方法 |
| JP2012082448A (ja) * | 2010-10-07 | 2012-04-26 | Sumitomo Bakelite Co Ltd | 基板処理装置および方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0362315B2 (enrdf_load_stackoverflow) | 1991-09-25 |
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