JPH0362315B2 - - Google Patents

Info

Publication number
JPH0362315B2
JPH0362315B2 JP60294765A JP29476585A JPH0362315B2 JP H0362315 B2 JPH0362315 B2 JP H0362315B2 JP 60294765 A JP60294765 A JP 60294765A JP 29476585 A JP29476585 A JP 29476585A JP H0362315 B2 JPH0362315 B2 JP H0362315B2
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
carrier bar
vibration
processing liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60294765A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62154798A (ja
Inventor
Toshuki Oonishi
Atsushi Matsumoto
Masayuki Niinami
Tomomichi Endo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Plantex Ltd
Original Assignee
Plantex Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plantex Ltd filed Critical Plantex Ltd
Priority to JP29476585A priority Critical patent/JPS62154798A/ja
Publication of JPS62154798A publication Critical patent/JPS62154798A/ja
Publication of JPH0362315B2 publication Critical patent/JPH0362315B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP29476585A 1985-12-27 1985-12-27 プリント基板製造装置 Granted JPS62154798A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29476585A JPS62154798A (ja) 1985-12-27 1985-12-27 プリント基板製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29476585A JPS62154798A (ja) 1985-12-27 1985-12-27 プリント基板製造装置

Publications (2)

Publication Number Publication Date
JPS62154798A JPS62154798A (ja) 1987-07-09
JPH0362315B2 true JPH0362315B2 (enrdf_load_stackoverflow) 1991-09-25

Family

ID=17812007

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29476585A Granted JPS62154798A (ja) 1985-12-27 1985-12-27 プリント基板製造装置

Country Status (1)

Country Link
JP (1) JPS62154798A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0311061U (enrdf_load_stackoverflow) * 1989-06-19 1991-02-01
JPH04103195A (ja) * 1990-08-22 1992-04-06 Toppan Printing Co Ltd 小径スルーホールプリント配線板の製造装置
JP2012082447A (ja) * 2010-10-07 2012-04-26 Sumitomo Bakelite Co Ltd 基板処理装置および方法
WO2011105072A1 (ja) * 2010-02-24 2011-09-01 住友ベークライト株式会社 基板処理方法および基板処理装置
JP2012082448A (ja) * 2010-10-07 2012-04-26 Sumitomo Bakelite Co Ltd 基板処理装置および方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5662998A (en) * 1979-10-24 1981-05-29 C Uyemura & Co Ltd Surface processing method dependent upon high-speed vibration
JPS5818798A (ja) * 1981-07-24 1983-02-03 株式会社日立製作所 センサチエツク装置
JPS6232690A (ja) * 1985-08-05 1987-02-12 三菱電機株式会社 プリント基板のめつき方法

Also Published As

Publication number Publication date
JPS62154798A (ja) 1987-07-09

Similar Documents

Publication Publication Date Title
KR100296780B1 (ko) 도금방법및도금장치
JPH0362315B2 (enrdf_load_stackoverflow)
JPH05508744A (ja) 複数の孔を有する被処理製品をその湿式化学処理時、例えば電気メッキ時に運動させる方法並びに該方法を実施する装置
KR920000969B1 (ko) 프린트기판 제조장치
EP0446522A1 (en) Electroless copper plating process
JP3599086B2 (ja) メッキ装置
JPH03275130A (ja) 液槽における液体の攪拌方法および装置
JPH0362314B2 (enrdf_load_stackoverflow)
JP2010058784A (ja) 発電機コイルを運搬する装置
JPS63305590A (ja) プリント配線板用基板の製造装置
JP4669647B2 (ja) スルーホールや凹みを有する回路板をパルス状刺激での処理するための装置と方法
JPS63307299A (ja) プリント配線板用基板の脱泡装置
JPH01263287A (ja) 洗浄処理装置
JPH01194388A (ja) プリント基板製造装置
JPH0522400B2 (enrdf_load_stackoverflow)
JP3286900B2 (ja) メッキ方法及びメッキ装置
KR102825903B1 (ko) 홀벽 도금불량을 개선하기 위한 인쇄회로기판 제조방법
JPH07326862A (ja) ブラインドホールの脱泡方法及び装置
JPH07197268A (ja) 面ファスナーのメッキ装置
JPS6232690A (ja) プリント基板のめつき方法
KR102542287B1 (ko) 기판 처리용 진동형 행거장치
JPH0832205A (ja) 印刷配線基板の脱水方法およびその脱水装置
CN119040994A (zh) 一种用于在印制电路板的通孔内电镀铜层的装置及方法
JP2000138440A (ja) プリント回路のエッチング方法
KR20240164985A (ko) 인쇄회로기판 도금장치