JPS62154798A - Manufacturing apparatus of printed wiring board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a printed circuit board manufacturing device that forms a coating layer on through holes in a printed circuit board. It can be applied to plating equipment, electroplating equipment, etc.

(Prior art) To form through holes in printed circuit boards, holes are made in the board using a press or drill, and then the board is immersed in a plating bath to electroless plate the inner periphery of the holes.

(Problem to be solved by the invention) However, in recent years, printed circuit boards have become more dense and multi-layered, resulting in thicker boards, while the diameter of through holes has become smaller, and the ratio between the hole diameter and hole length has become smaller. The aspect ratio is becoming larger. Therefore, in various liquid processing processes such as plating in small-diameter through-holes of high-density, multilayer boards, even if the entire board is inserted into the liquid, air bubbles remain in the through-holes and form on the inner periphery of the holes. The liquid may not be immersed, and manufacturing defects of printed circuit boards caused by these bubbles have become a problem.

Therefore, in view of the above-mentioned points, an object of the present invention is to increase density,
To completely remove air bubbles from small-diameter through holes in a multilayer board, and to prevent manufacturing defects in printed circuit boards caused by the air bubbles.

(Means for Solving the Problems) In order to achieve the above object, the present invention connects a printed circuit board having a through hole to a suspension member, and connects both ends of the suspension member to the left and right sides of a processing liquid tank. placing the printed circuit board on a support member provided in the processing liquid tank;
The magnet is attached to the support member so as to attract the suspension member, and a vibration generator is attached to the support member to vibrate the printed circuit board up and down.

(Function) That is, the present invention vibrates a printed circuit board that is immersed in a processing liquid tank and is undergoing liquid treatment in the vertical direction along the board surface, and at the same time, ensures that the vibration from the vibration source is applied to the printed circuit board. It is designed to completely eliminate air bubbles in the through-hole.

(Example) Hereinafter, the present invention will be described in detail with reference to the drawings.

FIG. 1 is a schematic perspective view of a first embodiment of the present invention applied to a manufacturing process line for printed circuit boards.

In the figure, numerals 1 and 2 are various processing liquid tanks that perform liquid processing such as plating processing when manufacturing the printed circuit board 3, respectively. The printed circuit board 3 has through holes 4 and is multilayered.

In the arrangement direction of the processing liquid tanks 1 and 2, a pair of carrier bar receivers 5.5 are respectively arranged along the left and right sides of the arrangement direction. A pair of left and right vibration generators 6.6 are arranged on the gear rear bar receivers 5, 5 at both left and right ends at the inlet of each processing liquid tank 1 and 2, respectively.

Reference numeral 7 designates a carrier bar as a suspension member, which suspends the Pudding 12Ji board 3 via a pair of left and right clips 8.8, and has a corresponding figure 7 receiver 9.9 of the vibration generator 6.6 at both left and right ends of the carrier bar. A figure 7 portion 10.10 is formed to fit with the 7-shaped portion 10.10.

Here, in order to increase the bonding force between the carrier bar 7 and the figure 7 receiver 9, the figure 7 portion 10 of the carrier bar 7 and the figure 7 receiver 9 are constructed as shown in FIG.

That is, in the figure 7 part 10, the suction plates 10A and IOA made of a magnetic material such as an iron plate are fixed to the inclined surface thereof, and the surfaces of the suction plates 10A and IOA are coated with corrosion-resistant plastic. In addition, the character 7 receiver 9 has a character 7 part 1 on its inclined part.
0 suction plate 10A.

Electromagnets 9A, 9A for adsorbing 10A are fixed, and each surface of these "1rL81 stones 9A, 9A is coated with corrosion-resistant plastic. Therefore, in the state shown in FIG. 2, the electromagnets 9A,
When 9A is applied, the electromagnets 9A and 9A cause the adsorption plate 1 to
Since 0A and IOA are absorbed, the carrier bar 7 and the figure 7 receiver 9 are firmly connected.

Note that instead of the electromagnet 9A described above, the attraction plate lOA may be made to attract or repel by changing the polarity of a permanent magnet.

Further, the carrier bar 7 is guided by a transport rod 11 of a transport device (not shown) to be movable in the arrangement direction of each processing liquid tank 1 and 2, and is positioned above the head of each processing liquid tank 1 and 2. When the carrier bar 7 is lowered, the carrier bar 7 can be positioned and fixed at that position when the figure 7 part 10 of the carrier bar 7 fits into the corresponding figure 7 receivers 9, 9.

Next, the vibration generator shown in FIG. 1 will be explained with reference to FIG. 3.

In the figure, reference numerals 12 and 12 indicate a pair of springs, the lower ends of which are fixed on the carrier bar receiver 5, and the upper ends of which are respectively fixed on both ends of the lower surface of the diaphragm 13, so that the diaphragm 13 is fixed on the carrier bar receiver 5. Provides elastic support. Furthermore, the figure 7 receiver 9 is fixed on the diaphragm 13 which is elastically supported on the carrier bar receiver 5.

14 is a vibration motor as a vibration source that vibrates the diaphragm 13 at a predetermined frequency, and is fixed to the lower surface of the diaphragm 13;
When this vibration motor 14 rotates, unbalanced weights fixed to both ends of the motor shaft cause the diaphragm 1
3 is configured to vibrate in the vertical direction against the elastic support of a pair of subrings 12 and 12.

This diaphragm 13 vibrates once when the vibration motor 14 rotates once, and the frequency thereof is preferably in the range of, for example, 50 times/min to 3000 times/min, particularly preferably 800 times/min to 900 times/min. , its amplitude is, for example, 1. Om+a~ 1
．． 8 mm is suitable.

Moreover, as a vibration source for the diaphragm 13, instead of the above-mentioned vibration motor 13, a so-called ? A magnetic vibrator may be used for 1.

Next, the operation of the first embodiment configured as described above will be explained. Here, the processing liquid tank 1 is, for example, a plating tank that performs electroless plating.

Now, when the printed circuit board 3 has finished its pre-processing process and is guided by the transport rod 11 of the transport device and arrives above the processing liquid tank 1 shown in FIG. 1, the carrier bar 7 is lowered at that position. When the carrier bar 7 is lowered and the 7-shaped portions 1O110 formed at both left and right ends are fitted into the corresponding 7-shaped receivers 9.9 and fixed in position, the transport rod 11 stops supporting the carrier bar 7. to return to the specified position above.

Here, the printed circuit board 3 suspended on the carrier bar 7 is
The carrier bar 7 is completely immersed in the liquid in the processing liquid tank 1, and the electromagnets 9A, 9A are energized, and the electromagnets 9A, 9A and the suction plate 10A of the figure 7 portion 10 are attracted to each other.
is firmly connected to the 7-character receiver 9.

Next, the vibration motors 14 in the pair of vibration generators 6.6 disposed at both left and right ends of the processing liquid tank 1 start operating, so that the diaphragms 13 start vibrating in the vertical direction. The vibration of this diaphragm 13 is caused by the 7-character receiver 9,
Since the vibration is transmitted to the printed circuit board 3 via the gear rear bar 7, the printed circuit board 3 starts vibrating in the vertical direction. At this time, since the carrier bar 7 is firmly coupled to the figure 7 receiver 9 by electromagnetic force, the vibration of the diaphragm 13 is reliably transmitted to the printed circuit board 3.

When the electroless plating solution in the processing solution tank 1 exceeds a predetermined temperature, the solution decomposes due to catalytic action, thereby forming a plating layer on the inner surface of the through hole 4.

In the process of forming the plating layer of the through hole 4, the printed circuit board 3 is constantly vibrating vertically as described above, so this vibration completely eliminates the air bubbles in the through hole and the air bubbles generated in the through hole. Can be removed. Therefore, a predetermined plating layer is reliably formed on the inner surfaces of all the through holes of the printed circuit board 3.

After that, when the formation of the through hole is completed, the electromagnet 9A
, 9A is de-energized, the transport rod 11 descends again, and the printed circuit board 3 integrated with the carrier bar 7 is lifted out of the processing liquid tank 1 to proceed to the next processing step.

Note that the above operation example describes plating processing, but
The present invention is not limited thereto, and can of course be applied to various liquid processing apparatuses for pre-processing and post-processing for plating printed circuit boards, as well as electroplating apparatuses.

Next, a second embodiment of the present invention will be described with reference to FIG. Note that the same parts as in FIG. 1 are denoted by the same reference numerals, and detailed explanation thereof will be omitted.

In the second embodiment, a processing basket 15 that can accommodate printed circuit boards 3 at predetermined intervals is hung on a carrier bar 7 so that a plurality of printed circuit boards 3 can be processed at once.

In such a configuration, if the processing liquid tank 1 is now used as a plating tank as in the first embodiment, during the plating process, a plurality of prints stored in the processing basket 15 are stored in the processing basket 15 as shown in FIG. The substrates 3 are housed in the processing liquid tank 1 all at once. During the cleaning process, vibrations from the vibration generator 6.6 are transmitted to each of the plurality of printed circuit boards 3, as in the first embodiment. At this time, the carrier bar 7 is firmly coupled to the figure 7 receiver 9 by electromagnetic force, and the vibration of the diaphragm 13 is reliably transmitted to the printed circuit board 3, so that the air bubbles in the through-hole can be completely removed by the vibration. .

(Effects of the Invention) As explained above, according to the present invention, a printed U-board immersed in a processing liquid tank and undergoing liquid treatment is vibrated by vibrations from vibration generators disposed on the left and right sides of the processing liquid tank. In addition to vibrating in the vertical direction along the board surface, we ensured that the vibration from the vibration source was transmitted to the printed circuit board and completely removed air bubbles in the through holes.
Various liquid treatments are completed, and manufacturing defects of printed circuit boards due to bubbles can be prevented.

In addition, since the printed circuit board of the present invention vibrates as described above, the life of each processing liquid in which the printed circuit board is immersed is extended, and smear in the through hole (
Chips generated when drilling through-holes are easily removed, so there is no chance of defects caused by smear.

Furthermore, when the present invention is used in the copper plating process, the fine bubbles of hydrogen gas generated during copper deposition are quickly released by the vibration of the printed circuit board, so the properties of copper (elongation rate and tensile strength) are significantly improved. .

[Brief explanation of drawings]

Fig. 1 is a perspective view of the first embodiment of the present invention, Fig. 2 is a sectional view showing the structure of the figure 7 receiver and the figure 7 part, Fig. 3 is a schematic configuration diagram of the vibrating device, and Fig. 4 is the structure of the vibration device. A perspective view of the second embodiment, and FIG. 5 is a sectional view thereof. 1.2 is a processing liquid tank, 3 is a printed circuit board, 4 is a through hole, 5 is a carrier bar receiver, 6 is a vibration generator, 7 is a carrier bar, 13 is a diaphragm, and 14 is a vibration motor. Patent applicant Plantex Co., Ltd. Agent
Maki Tobe (and 2 others) Figure 1

Claims (1)

[Scope of Claims] 1) A printed circuit board having a through-hole is connected to a suspension member, and both ends of the suspension member are placed on support members provided on the left and right sides of a processing liquid tank. The substrate is suspended in a processing liquid tank, and a magnet is attached to the support member to attract the suspension member, and a vibration generator is attached to the support member to vibrate the printed circuit board up and down. Printed circuit board manufacturing equipment consisting of 2) The printed circuit board manufacturing apparatus according to claim 1, wherein the magnet can be switched between excitation and demagnetization.