JPH0522400B2 - - Google Patents
Info
- Publication number
- JPH0522400B2 JPH0522400B2 JP8961288A JP8961288A JPH0522400B2 JP H0522400 B2 JPH0522400 B2 JP H0522400B2 JP 8961288 A JP8961288 A JP 8961288A JP 8961288 A JP8961288 A JP 8961288A JP H0522400 B2 JPH0522400 B2 JP H0522400B2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- processing liquid
- liquid tank
- container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000007788 liquid Substances 0.000 claims description 46
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000007747 plating Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 9
- 238000007772 electroless plating Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
- H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Chemically Coating (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、プリント基板を液処理するプリント
基板製造装置に関し、特にプリント基板のスルー
ホールメツキ前処理装置のほか、無電解メツキ装
置、電気メツキ装置、並びに洗浄処理装置などに
適用可能なものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a printed circuit board manufacturing apparatus that liquid-processes printed circuit boards, and in particular to a pre-treatment apparatus for through-hole plating of printed circuit boards, as well as electroless plating apparatus and electroplating apparatus. It is applicable to equipment, cleaning processing equipment, etc.
（従来の技術）
この種の装置としては、すでに本発明の発明者
らが提案したように、キヤリヤバーに支持された
プリント基板を処理液槽内に浸漬して液処理する
ときに、そのプリント基板を搬送装置の搬送杆か
ら分離独立させ、この状態でプリント基板に振動
発生器の振動を与え、これによりスルーホール中
の気泡を除去するようにしたものが知られている
（特開昭60−294764号公報）。(Prior Art) As already proposed by the inventors of the present invention, this type of device is used to process a printed circuit board supported by a carrier bar by immersing it in a processing liquid tank. It is known that the printed circuit board is separated and independent from the transport rod of the transport device, and in this state the printed circuit board is subjected to vibration from a vibration generator, thereby removing air bubbles in the through holes (Japanese Patent Application Laid-Open No. 1983-1999). 294764).
（発明が解決しようとする問題点）
しかし、従来装置は、上述のようにプリント基
板を搬送装置の搬送杆から分離独立させて振動発
生器で振動するように構成するので、プリント基
板を搬送装置からいちいち分離独立せずに吊して
連結したまま液処理する工程ラインには適用でき
ないという問題が生じていた。(Problem to be Solved by the Invention) However, in the conventional device, as described above, the printed circuit board is separated and independent from the transport rod of the transport device and is configured to vibrate with a vibration generator. A problem has arisen in that it cannot be applied to a process line in which liquids are processed while being suspended and connected without being separated and independent.
そこで、本発明は、上記の問題を解消すること
を目的とする。 Therefore, the present invention aims to solve the above problem.
（問題点を解決するための手段）
かかる目的を達成するために、本発明は以下の
ような構成とした。(Means for Solving the Problems) In order to achieve the above object, the present invention has the following configuration.
すなわち、請求項１の発明は、小孔を有するプ
リント基板を遊動自在に吊す部材と、
その吊し部材に吊してプリント基板を浸漬する
処理液槽と、
その処理液槽を振動する振動発生器とからな
り、
前記処理液槽が振動するときに、その処理液槽
の内面が前記プリト基板に接触できるようにして
なる。 That is, the invention of claim 1 provides a member for freely hanging a printed circuit board having small holes, a processing liquid tank for suspending the printed circuit board from the hanging member and immersing the printed circuit board, and a vibration generator for vibrating the processing liquid tank. When the processing liquid tank vibrates, the inner surface of the processing liquid tank can come into contact with the printed circuit board.
また、請求項２の発明は、小孔を有するプリン
ト基板を遊動自在に吊す部材と、
その吊し部材に吊してプリント基板を浸漬する
処理液槽と、
前記プリント基板を前記処理液槽に浸漬したと
きにそのプリント基板を収容する収容体と、
その収容体を振動する振動発生器とからなり、
前記収容体が振動するときに、その収容体が前
記プリント基板に接触できるようにしてなる。 Further, the invention according to claim 2 provides the following: a member for freely hanging a printed circuit board having small holes; a processing liquid tank for suspending the printed circuit board from the hanging member and immersing the printed circuit board in the processing liquid tank; It consists of a container that accommodates the printed circuit board when immersed, and a vibration generator that vibrates the container, so that the container can come into contact with the printed circuit board when the container vibrates. .
（作用）
請求項１の発明では、処理液槽１が振動発生器
９によつて振動すると、処理液槽１の内面が遊動
自在な吊し片４に吊されたプリント基板２に接触
するので、処理液槽１内でプリント基板２が振動
する。(Function) In the invention of claim 1, when the processing liquid tank 1 is vibrated by the vibration generator 9, the inner surface of the processing liquid tank 1 comes into contact with the printed circuit board 2 suspended by the freely movable hanging piece 4. , the printed circuit board 2 vibrates within the processing liquid tank 1.
従つて、プリント基板２は吊し片４に吊された
ままの状態でその小孔３内にメツキ膜が確実に形
成される。 Therefore, the plating film is reliably formed in the small hole 3 while the printed circuit board 2 is suspended from the hanging piece 4.
また、請求項２の発明では、収容体１１が振動
発生器１３によつて振動すると、収容体１１が遊
動自在な吊し片４に吊されたプリント基板２に接
触するので、処理液槽１内でプリント基板２が振
動する。 Further, in the invention of claim 2, when the container 11 is vibrated by the vibration generator 13, the container 11 comes into contact with the printed circuit board 2 suspended by the freely movable hanging piece 4, so that the processing liquid tank 1 The printed circuit board 2 vibrates inside.
従つて、プリント基板２は吊し片４に吊された
ままの状態でその小孔３内にメツキ膜が確実に形
成される。 Therefore, the plating film is reliably formed in the small hole 3 while the printed circuit board 2 is suspended from the hanging piece 4.
（実施例） 第１図は本発明の実施例を示す。(Example) FIG. 1 shows an embodiment of the invention.
図において、１はプリント基板２の製造工程ラ
インに適用され、メツキ処理などの液体処理を行
う各種の処理液槽である。 In the figure, reference numeral 1 denotes various processing liquid tanks that are applied to a manufacturing process line for printed circuit boards 2 and perform liquid processing such as plating processing.
プリント基板２は、スルーホールなどを形成す
るための小孔３を有し、両面板や多層板などが好
適である。 The printed circuit board 2 has small holes 3 for forming through holes, and is preferably a double-sided board or a multilayer board.
４はプリント基板２を処理液槽１内に遊動自在
に吊す吊し片であり、その吊し片４の上端を搬送
装置６の搬送棒５に掛ける。搬送棒５は、搬送装
置６に設けた案内ガイド（図示せず）に案内され
るとともに、プリント基板２の液体処理の際に第
１図の位置で停止する。 Reference numeral 4 denotes a hanging piece for freely hanging the printed circuit board 2 in the processing liquid tank 1, and the upper end of the hanging piece 4 is hung on the conveying rod 5 of the conveying device 6. The transport rod 5 is guided by a guide (not shown) provided on the transport device 6, and stops at the position shown in FIG. 1 when the printed circuit board 2 is processed with liquid.
処理液槽１は、その左右の上端部１Ａ，１Ｂを
左右一対のスプリング７，７を介在して外枠８の
上端部に弾性支持する。そして、その処理液槽１
の上端部１Ａ，１Ｂ上には、処理液槽１を振動さ
せるバイブレータや振動モータなどの振動発生器
９，９をそれぞれ取付ける。 The processing liquid tank 1 has its left and right upper ends 1A and 1B elastically supported by the upper end of an outer frame 8 via a pair of left and right springs 7, 7. And the processing liquid tank 1
Vibration generators 9, 9, such as a vibrator or a vibration motor, for vibrating the processing liquid tank 1 are mounted on the upper ends 1A, 1B, respectively.
また処理液槽１は、例えば図示のように漏斗状
とし、その底部側の内容をプリント基板２の横幅
よりもわずかに大きくする。これにより、後述の
ように処理液槽１が振動するときに、処理液槽１
がプリント基板２に接触してプリント基板２が振
動する。 Further, the processing liquid tank 1 is, for example, shaped like a funnel as shown in the figure, and the contents on the bottom side thereof are made slightly larger than the width of the printed circuit board 2. As a result, when the processing liquid tank 1 vibrates as described later, the processing liquid tank 1
contacts the printed circuit board 2, and the printed circuit board 2 vibrates.
なお、処理液槽１は、後述のように振動すると
きにプリント基板と容易に接触できるような関係
にあれば、その形状等は上述のものに限定される
ものではない。 The shape of the processing liquid tank 1 is not limited to that described above, as long as it can easily come into contact with the printed circuit board when vibrating as described later.
次に、このように構成する実施例の動作例につ
いて説明する。ここで、処理液槽１を例えば無電
解メツキを行うメツキ槽とする。 Next, an example of the operation of the embodiment configured as described above will be described. Here, the processing liquid tank 1 is assumed to be a plating tank for performing electroless plating, for example.
いま、前工程処理を終了したプリント基板２
が、搬送装置６の搬送棒５に吊し片４で吊された
状態で搬送され、その搬送棒５が第１図に示す位
置で停止すると、プリント基板２は搬送棒５に吊
されたまま処理液槽１内に浸漬された状態とな
る。 Printed circuit board 2 that has now undergone pre-processing
is transported while being suspended from the transport bar 5 of the transport device 6 by the hanging piece 4, and when the transport bar 5 stops at the position shown in FIG. 1, the printed circuit board 2 remains suspended from the transport bar 5. It is in a state of being immersed in the processing liquid tank 1.
ここで、振動発生器９が起動し、これにより処
理液槽１が振動を開始するので、処理液槽１の内
面が遊動自在な吊し片４に吊されたプリント基板
２に接触し、処理液槽１内でプリント基板２が振
動する。 At this point, the vibration generator 9 is activated and the processing liquid tank 1 starts vibrating, so that the inner surface of the processing liquid tank 1 comes into contact with the printed circuit board 2 suspended by the freely movable hanging piece 4, and the processing liquid tank 1 starts vibrating. The printed circuit board 2 vibrates within the liquid tank 1.
そして、小孔３内におけるメツキ層の形成過程
において、このようにプリント基板２は常時振動
状態にあるので、この振動によつて小孔３中の気
泡や小孔３内に発生する気泡が完全に除去でき
る。そのため、プリント基板２は、全ての小孔３
の内周に所定のメツキ膜が確実に形成される。 In the process of forming the plating layer in the small holes 3, the printed circuit board 2 is constantly in a state of vibration, so the vibrations completely eliminate the air bubbles in the small holes 3 and the air bubbles generated in the small holes 3. can be removed. Therefore, the printed circuit board 2 has all the small holes 3.
A predetermined plating film is reliably formed on the inner periphery of the plate.
その後、小孔３内のメツキ膜形成が終了する
と、搬送装置６の搬送棒５が搬送を開始し、プリ
ント基板２が処理液槽１内から引き上げられ、次
工程の処理のために搬送される。 After that, when the plating film formation in the small holes 3 is completed, the transport rod 5 of the transport device 6 starts transporting, and the printed circuit board 2 is pulled up from the processing liquid tank 1 and transported for the next process. .
第２図は本発明の他の実施例を示す。 FIG. 2 shows another embodiment of the invention.
図において、１０はプリント基板２の製造工程
ラインに適用され、メツキ処理などの液体処理を
行う各種の処理液槽である。 In the figure, reference numeral 10 denotes various processing liquid tanks that are applied to the manufacturing process line of the printed circuit board 2 and perform liquid processing such as plating processing.
１１はプリント基板２を処理液槽１０内に浸漬
するときに収容する収容体であり、左右一対のス
プリング１２，１２を介在して処理液槽１０内に
配置する。そして、収容体１１の左右の上端突部
１１Ａ，１１Ｂ上には、その収容体１１を振動す
る振動発生器１３，１３をそれぞれ取付ける。 Reference numeral 11 denotes a container that accommodates the printed circuit board 2 when it is immersed in the processing liquid tank 10, and is placed in the processing liquid tank 10 with a pair of left and right springs 12, 12 interposed therebetween. Vibration generators 13, 13 for vibrating the container 11 are mounted on the left and right upper end protrusions 11A, 11B of the container 11, respectively.
収容体１１は、例えば図示のように漏斗状にす
るとともに、処理液槽１０内に浸漬する部分は処
理液が充満するように多数の通孔１４を穿つた
り、または網目状とする。また、収容体１１の底
部側の内径をプリント基板２の横幅よりもわずか
に大きくする。 The container 11 has, for example, a funnel shape as shown in the figure, and the portion to be immersed in the processing liquid tank 10 has a large number of through holes 14 or has a mesh shape so that it is filled with the processing liquid. Further, the inner diameter of the bottom side of the container 11 is made slightly larger than the width of the printed circuit board 2.
これにより、後述のように収容体１１が振動す
るときに、収容体１１がプリント基板２に接触し
てプリント基板２が振動する。 As a result, when the container 11 vibrates as described later, the container 11 contacts the printed circuit board 2 and the printed circuit board 2 vibrates.
なお、収容体１１は、後述のように振動すると
きプリント基板２と容易に接触できるような関係
にあれば、その形状等は上述のものに限定される
ものではない。 Note that the shape and the like of the container 11 are not limited to those described above, as long as the container 11 is in a relationship such that it can easily come into contact with the printed circuit board 2 when vibrating as described later.
次に、このように構成する他の実施例の動作例
について説明する。ここで、処理液槽１０を例え
ば無電解メツキを行うメツキ槽とする。 Next, an example of the operation of another embodiment configured in this manner will be described. Here, the processing liquid tank 10 is assumed to be a plating tank for performing electroless plating, for example.
いま前工程が終了したプリント基板２が、搬送
装置６の搬送棒５に吊し片４で吊された状態で搬
送され、その搬送棒５が第２図で示す位置で停止
すると、プリント基板２は搬送棒５に吊されたま
ま収容体１１を介して処理液槽１０内に浸漬され
た状態となる。 The printed circuit board 2, which has now undergone the previous process, is transported while being suspended by the hanging piece 4 on the transport bar 5 of the transport device 6. When the transport bar 5 stops at the position shown in FIG. 2, the printed circuit board 2 is suspended from the transport rod 5 and immersed in the processing liquid tank 10 via the container 11.
ここで、振動発生器１３が起動し、これにより
収容体１１が振動を開始するので、収容体１１が
遊動自在な吊し片４に吊されたプリント基板２に
接触し、処理液槽１内でプリント基板２が振動す
る。 Here, the vibration generator 13 is started, and the container 11 starts vibrating, so that the container 11 comes into contact with the printed circuit board 2 suspended from the freely movable hanging piece 4, and the inside of the processing liquid tank 1 The printed circuit board 2 vibrates.
そして、小孔３内におけるメツキ層の形成過程
において、このようにプリント基板２は常時振動
状態にあるので、この振動によつて小孔３中の気
泡や小孔３内に発生する気泡が完全に除去でき
る。そのため、プリント基板２は、全ての小孔３
の内周に所定のメツキ膜が確実に形成される。 In the process of forming the plating layer in the small holes 3, the printed circuit board 2 is constantly in a state of vibration, so the vibrations completely eliminate the air bubbles in the small holes 3 and the air bubbles generated in the small holes 3. can be removed. Therefore, the printed circuit board 2 has all the small holes 3.
A predetermined plating film is reliably formed on the inner periphery of the plate.
その後、小孔３内のメツキ膜形成が終了する
と、搬送装置６の搬送棒５が搬送を開始し、プリ
ント基板２が収容体１１から引き上げられ、次工
程の処理のために搬送される。 Thereafter, when the formation of the plating film in the small holes 3 is completed, the transport rod 5 of the transport device 6 starts transporting, and the printed circuit board 2 is pulled up from the container 11 and transported for the next process.
（発明の効果）
以上のように本発明によれば、プリント基板を
吊したままの状態で処理液槽内において振動でき
るようにしたので、プリント基板を吊したままの
状態でその小孔にメツキ膜を確実に形成すること
ができる。従つて、本発明は、プリント基板を搬
送装置からいちいち分離せずに搬送しながら製造
する工程ラインに適用することができる。(Effects of the Invention) As described above, according to the present invention, it is possible to vibrate the printed circuit board in the processing liquid tank while it is suspended, so that the small holes of the printed circuit board can be plated while the printed circuit board is suspended. A film can be reliably formed. Therefore, the present invention can be applied to a process line in which printed circuit boards are manufactured while being transported without being separated from the transport device one by one.
第１図は本発明の実施例の断面図、第２図は本
発明の他の実施例の断面図である。
１，１０は処理液槽、２はプリント基板、３は
小孔、４は吊し片、６は搬送装置、９，１３は振
動発生器、１１は収容体。
FIG. 1 is a sectional view of an embodiment of the invention, and FIG. 2 is a sectional view of another embodiment of the invention. 1 and 10 are treatment liquid tanks, 2 is a printed circuit board, 3 is a small hole, 4 is a hanging piece, 6 is a transport device, 9 and 13 are vibration generators, and 11 is a container.
Claims (1)
吊し部材と、 その吊し部材に吊してプリント基板を浸漬する
処理液槽と、 その処理液槽を振動する振動発生器とからな
り、 前記処理液槽が振動するときに、その処理液槽
の内面が前記プリント基板に接触できるようにし
てなるプリント基板製造装置。 ２ 小孔を有するプリント基板を遊動自在に吊す
吊し部材と、 その吊し部材に吊してプリント基板を浸漬する
処理液槽と、 前記プリント基板を前記処理液槽に浸漬したと
きにそのプリント基板を収容する収容体と、 その収容体を振動する振動発生器とからなり、 前記収容体が振動するときに、その収容体が前
記プリント基板に接触できるようにしてなるプリ
ント基板製造装置。[Scope of Claims] 1. A hanging member for freely hanging a printed circuit board having a small hole, a processing liquid tank in which the printed circuit board is suspended by the hanging member and immersed therein, and a vibration generator for vibrating the processing liquid tank. 1. A printed circuit board manufacturing apparatus comprising: a container, the inner surface of the processing liquid tank being able to come into contact with the printed circuit board when the processing liquid tank vibrates. 2. A hanging member for freely hanging a printed circuit board having small holes; a processing liquid tank for suspending the printed circuit board from the hanging member and immersing the printed circuit board; 1. A printed circuit board manufacturing apparatus, comprising: a container that accommodates a board; and a vibration generator that vibrates the container, the container being able to come into contact with the printed circuit board when the container vibrates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8961288A JPH01260887A (en) | 1988-04-12 | 1988-04-12 | Apparatus for manufacturing printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8961288A JPH01260887A (en) | 1988-04-12 | 1988-04-12 | Apparatus for manufacturing printed board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01260887A JPH01260887A (en) | 1989-10-18 |
| JPH0522400B2 true JPH0522400B2 (en) | 1993-03-29 |
Family
ID=13975572
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8961288A Granted JPH01260887A (en) | 1988-04-12 | 1988-04-12 | Apparatus for manufacturing printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01260887A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2835494B2 (en) * | 1994-06-17 | 1998-12-14 | 東製株式会社 | Cleaning equipment |
-
1988
- 1988-04-12 JP JP8961288A patent/JPH01260887A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01260887A (en) | 1989-10-18 |
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