JPH01260887A - Apparatus for manufacturing printed board - Google Patents
Apparatus for manufacturing printed boardInfo
- Publication number
- JPH01260887A JPH01260887A JP8961288A JP8961288A JPH01260887A JP H01260887 A JPH01260887 A JP H01260887A JP 8961288 A JP8961288 A JP 8961288A JP 8961288 A JP8961288 A JP 8961288A JP H01260887 A JPH01260887 A JP H01260887A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- printed board
- processing liquid
- liquid tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 7
- 239000007788 liquid Substances 0.000 claims abstract description 52
- 238000007747 plating Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 10
- 238000007772 electroless plating Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 235000011962 puddings Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
- H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Chemically Coating (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、プリント基板を液処理するプリント基板製造
装近に関し、特にプリント基板のスルーホールメツキ前
処理装置のほか、無電解メツキ装置、電気メツキ装置、
並びに洗浄処理装置などに適用可能なものである。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a printed circuit board manufacturing equipment that processes printed circuit boards with liquid, and in particular to through-hole plating pre-treatment equipment for printed circuit boards, as well as electroless plating equipment, electric plating equipment, etc. Metsuki device,
It is also applicable to cleaning processing equipment and the like.
（従来の技術）
この種の装けとしては、すでに本発明の発明者らが提案
したように、キャリヤバーに支持されたプリント基板を
処理液槽内に浸漬して液処理するときに、そのプリント
基板を搬送装置の搬送杆から分離独立させ、この状７ｇ
でプリント基板に振動発生器の振動を与え、これにより
スルーホール中の気泡を除去するようにしたものが知ら
れている（特開昭６０−２９４７６４号公報）。(Prior Art) As already proposed by the inventors of the present invention, this type of equipment is used when a printed circuit board supported by a carrier bar is immersed in a processing liquid tank for liquid treatment. The printed circuit board is separated and independent from the transport rod of the transport device, and in this state 7g
There is a known method in which a vibration generator applies vibration to a printed circuit board, thereby removing air bubbles in a through hole (Japanese Patent Application Laid-Open No. 60-294764).
（発明が解決しようとする問題点）
しかし、従来装置は、上述のようにプリント基板を搬送
装置の搬送杆から分離独立させて振動発生器で振動する
ように構成するので、プリント基板を搬送装置からいち
いち分離独立せずに吊して連結したまま液処理する工程
ラインには適用できないという問題が生じていた。(Problem to be Solved by the Invention) However, in the conventional device, as described above, the printed circuit board is separated and independent from the transport rod of the transport device and is configured to vibrate with a vibration generator. A problem has arisen in that it cannot be applied to a process line in which liquids are processed while being suspended and connected without being separated and independent.
そこで１本発明は、１−記の問題を解消することを［１
的とする。Therefore, 1 the present invention aims to solve the problem described in 1- [1]
target
（問題点を解決するための手段）
かかる目的を達成するために、本発明は以下のような構
成とした。(Means for Solving the Problems) In order to achieve the above object, the present invention has the following configuration.
すなわち、請求項１の発明は、小孔を有するプリント基
板を遊動自在に吊す吊し部材と、その吊し部材に吊して
プリント基板を浸漬する処理液槽と。That is, the invention according to claim 1 provides a hanging member for freely hanging a printed circuit board having small holes, and a processing liquid tank for suspending the printed circuit board from the hanging member and immersing the printed circuit board therein.
その処理液槽を振動する振動発生器とからなり。It consists of a vibration generator that vibrates the processing liquid tank.
前記処理液槽が振動するときに、その処理液槽の内面が
前記プリントノ、（板に接触できるようにしてなる。When the processing liquid tank vibrates, the inner surface of the processing liquid tank can come into contact with the printing plate.
また、請求項２の発明は、小孔を有するプリント基板を
か動自在に吊す吊し部材と、
その吊し部材に吊してプリント基板を浸漬する処理液槽
と、
前記プリント基板を前記処理液槽に浸漬したときにその
プリント基板を収容する収容体と、その収容体を振動す
る振動発生器とからなり、
前記収容体が振動するときに、その収容体が前記プリン
ト基板に接触できるようにしてなる。Further, the invention according to claim 2 provides the following: a hanging member for movably suspending a printed circuit board having small holes; a processing liquid tank for suspending the printed circuit board from the hanging member and immersing the printed circuit board; It consists of a container that accommodates the printed circuit board when immersed in a liquid bath, and a vibration generator that vibrates the container, so that the container can come into contact with the printed circuit board when the container vibrates. It becomes.
（作用）
請求項１の発明では、処理液槽１が振動発生器９によっ
て振動すると、処理液槽ｌの内面が遊動自在な吊し片４
に吊されたプリント基板２に接触するので、処理液槽ｌ
内でプリント基板２が振動する。(Function) In the invention of claim 1, when the processing liquid tank 1 is vibrated by the vibration generator 9, the inner surface of the processing liquid tank 1 is moved freely.
Since it comes into contact with the printed circuit board 2 suspended on the
The printed circuit board 2 vibrates inside.
従って、プリント基板２は吊し片４をこ吊されたままの
状態でその小孔３内にメツキ膜が確実に形成される。Therefore, the plating film is reliably formed in the small hole 3 of the printed circuit board 2 while it is suspended by the hanging piece 4.
また、請求項２の発明では、収容体１１が振動発生器１
３によって振動すると、収容体１１が遊動自在な吊し片
４に吊されたプリント基板２に接触するので、処理液槽
１内でプリント基板２が振動する。In addition, in the invention of claim 2, the container 11 is the vibration generator 1.
3, the container 11 comes into contact with the printed circuit board 2 suspended by the freely movable hanging piece 4, so that the printed circuit board 2 vibrates within the processing liquid tank 1.
従って、プリント基板２は吊し片４に吊されたままの状
態でその小孔３内にメツキ膜が確実に形成される。Therefore, the plating film is reliably formed in the small hole 3 of the printed circuit board 2 while it is suspended from the hanging piece 4.
（実施例） 第１図は本発明の実施例を示す。(Example) FIG. 1 shows an embodiment of the invention.
図において、１はプリント基板２の製造工程ラインに適
用され、メツキ処理などの液体処理を行う各種の処理液
槽である。In the figure, reference numeral 1 denotes various processing liquid tanks that are applied to a manufacturing process line for printed circuit boards 2 and perform liquid processing such as plating processing.
プリント基板２は、スルーホールなどを形成するための
小孔３を有し１両面板や多層板などが好適である。The printed circuit board 2 has small holes 3 for forming through holes, and is preferably a single-sided board or a multilayer board.
４はプリント基板２を処理液槽１内に遊動自在に吊す吊
し片であり、その吊し片４のＬ端を搬送装置６の搬送棒
５に掛ける。Ｗａ送棒５は、搬送装置６に設けた案内ガ
イド（図示せず）に案内されるとともに、プリント基板
２の液体処理の際に第１図の位置で停止する。Reference numeral 4 denotes a hanging piece for freely hanging the printed circuit board 2 in the processing liquid tank 1, and the L end of the hanging piece 4 is hung on the conveying rod 5 of the conveying device 6. The Wa feeding rod 5 is guided by a guide (not shown) provided on the conveying device 6, and stops at the position shown in FIG. 1 during liquid treatment of the printed circuit board 2.
処理液槽ｌは、その左右の上端部ＬＡ、ＩＢを左右一対
のスプリング７．７を介在して外枠８の上端部にりｉ性
支持する。そして、その処理液槽１の上端部ＩＡ、ＩＢ
」−には、処理液槽１を振動させるバイブレータや振動
モータなどの振動発生器９．９をそれぞれ取付ける。The processing liquid tank 1 has its left and right upper ends LA, IB supported by the upper end of the outer frame 8 via a pair of left and right springs 7.7. The upper end portions IA and IB of the processing liquid tank 1 are
A vibration generator 9.9, such as a vibrator or a vibration motor, for vibrating the processing liquid tank 1 is attached to each of the parts.
また処理液槽ｌは、例えば図示のように漏斗状とし、そ
の底部側の内径をプリント基板２の横幅よりもわずかに
大きくする。これにより、後述のように処理液＋６１が
振動するときに、処理液槽１がプリント基板２に接触し
てプリント基板２が振動する。Further, the processing liquid tank l has a funnel shape, for example, as shown in the figure, and the inner diameter at the bottom side thereof is slightly larger than the width of the printed circuit board 2. As a result, when the processing liquid +61 vibrates as described later, the processing liquid tank 1 contacts the printed circuit board 2, and the printed circuit board 2 vibrates.
なお、処理液槽１は、後述のように振動するときにプリ
ント基板と容易に接触できるような関係にあれば、その
形状等は−Ｌ述のものに限定されるものではない。Note that the shape of the processing liquid tank 1 is not limited to that described in -L, as long as it is in a relationship such that it can easily come into contact with the printed circuit board when vibrating as described below.
次に、このように構成する実施例の動作例について説明
する。ここで、処理液槽ｌを例えば無電解メツキを行う
メツキ槽とする。Next, an example of the operation of the embodiment configured as described above will be explained. Here, the processing liquid tank 1 is assumed to be a plating tank for performing electroless plating, for example.
いま、前工程処理を終了したプリント基板２が、搬送装
置６の搬送棒５に吊し片４で吊された状態で搬送され、
その搬送棒５が第１図で示す位置で停＋ｈすると、プリ
ント基板２は搬送棒５に吊されたまま処理液槽１内に浸
漬された状態となる。Now, the printed circuit board 2 that has undergone the pre-processing process is transported while being suspended from the transport rod 5 of the transport device 6 by the hanging piece 4.
When the transport rod 5 stops at the position shown in FIG. 1, the printed circuit board 2 is suspended from the transport rod 5 and immersed in the processing liquid tank 1.
ここで、振動発生器９が起動し、これにより処理液槽ｌ
が振動を開始するので、処理液槽ｌの内面が遊動自在な
吊し片４に吊されたプリント基板２に接触し、処理液槽
ｌ内でプリント基板２が振動する。At this point, the vibration generator 9 is activated, which causes the processing liquid tank l to be activated.
starts to vibrate, so that the inner surface of the processing liquid tank 1 comes into contact with the printed circuit board 2 suspended by the freely movable hanging piece 4, and the printed circuit board 2 vibrates within the processing liquid tank 1.
そして、小孔３内におけるメツキ層の形成過程において
、このようにプリント基板２は常時振動状態にあるので
、この振動によって小孔３中の気泡や小孔３内に発生す
る気泡が完全に除去できる。そのため、プリント基板２
は、全ての小孔３の内周に所定のメツキ膜が確実に形成
される。During the process of forming the plating layer inside the small holes 3, the printed circuit board 2 is constantly in a state of vibration, so the vibrations completely remove the air bubbles in the small holes 3 and the air bubbles generated inside the small holes 3. can. Therefore, printed circuit board 2
This ensures that a predetermined plating film is formed on the inner periphery of all the small holes 3.
その後、小孔３内のメツキ膜形成が終了すると、搬送装
置６の搬送棒５が搬送を開始し、プリント基板２が処理
液槽ｌ内から引き上げられ、次工程の処理のために搬送
される。After that, when the plating film formation in the small holes 3 is completed, the transport rod 5 of the transport device 6 starts transporting, and the printed circuit board 2 is pulled up from the processing liquid tank l and transported for the next process. .
第２図は本発明の他の実施例を示す。FIG. 2 shows another embodiment of the invention.
図において、１０はプリント基板２の製造工程ラインに
適用され、メツキ処理などの液体処理を行う各種の処理
液槽である。In the figure, reference numeral 10 denotes various processing liquid tanks that are applied to the manufacturing process line of the printed circuit board 2 and perform liquid processing such as plating processing.
１１はプリント基板２を処理液槽ｌＯ内に浸漬するとき
に収容する収容体であり、左右一対のスプリング１２．
１２を介在して処理液槽ｌＯ内に配置する。そして、収
容体１１の左右の上端突部１１Ａ、ＩＩＢ上には、その
収容体１１を振動する振動発生器１３．１３をそれぞれ
取付ける。Reference numeral 11 denotes a container that accommodates the printed circuit board 2 when it is immersed in the processing liquid tank IO, and includes a pair of left and right springs 12.
12 in the processing liquid tank IO. Vibration generators 13 and 13 for vibrating the container 11 are respectively attached to the left and right upper end protrusions 11A and IIB of the container 11.
収容体１１は、例えば図示のように漏斗状にするととも
に、処理液４６ｉｏ内に浸漬する部分は処理液が充満す
るように多数の通孔１４を穿ったり、または網目状とす
る。また、収容体１１の底部側の内径をプリント基板２
の横幅よりもわずかに犬きくする。The container 11 has, for example, a funnel shape as shown in the figure, and the portion to be immersed in the processing liquid 46io has a large number of through holes 14 or has a mesh shape so as to be filled with the processing liquid. Also, the inner diameter of the bottom side of the container 11 is set to the printed circuit board 2.
It is slightly wider than the width.
これにより、後述のように収容体１１が振動するときに
、収容体１１がプリント基板２に接触してプリント基板
２が振動する。As a result, when the container 11 vibrates as described later, the container 11 contacts the printed circuit board 2 and the printed circuit board 2 vibrates.
なお、収容体１１は、後述のように振動するときにプリ
ント基板２と容易に接触できるような関係にあれば、そ
の形状等は上述のものに限定されるものではない。Note that the shape and the like of the container 11 are not limited to those described above, as long as the container 11 is in a relationship such that it can easily come into contact with the printed circuit board 2 when vibrating as described later.
次に、このように構成する他の実施例の動作例について
説明する。ここで、処理液槽ｌＯを例えば無電解メツキ
を行うメツキ槽とする。Next, an example of the operation of another embodiment configured in this manner will be described. Here, the processing liquid tank IO is assumed to be a plating tank for performing electroless plating, for example.
いま前工程が終了したプリント基板２が、搬送装置６の
搬送棒５に吊し片４で吊された状態で搬送され、その搬
送棒５が第２図で示す位置で停止すると、プリント基板
２は搬送棒５に吊されたまま収容体１１を介して処理液
槽１０内に浸漬された状態となる。The printed circuit board 2, which has now undergone the previous process, is transported while being suspended by the hanging piece 4 on the transport bar 5 of the transport device 6. When the transport bar 5 stops at the position shown in FIG. 2, the printed circuit board 2 is suspended from the transport rod 5 and immersed in the processing liquid tank 10 via the container 11.
ここで、振動発生器１３が起動し、これにより収容体１
１が振動を開始するので、収容体１１が遊動自在な吊し
片４に吊されたプリント基板２に接触し、処理液槽ｌ内
でプリント基板２が振動する。At this point, the vibration generator 13 is activated, which causes the container 1 to
1 starts to vibrate, the container 11 comes into contact with the printed circuit board 2 suspended from the freely movable hanging piece 4, and the printed circuit board 2 vibrates within the processing liquid tank l.
そして、小孔３内におけるメツキ層の形成過程において
、このようにプリン１ｌＪｉ板２は常時振動状７ｇにあ
るので、この振動によって小孔３中の気泡や小孔３内に
発生する気泡が完全に除去できる。そのため、プリント
基板２は、全ての小孔３の内周に所定のノー２キ膜が確
実に形成される。In the process of forming the plating layer inside the small holes 3, the pudding 1lJi plate 2 is always in the vibrating state 7g, so that the vibrations completely eliminate the air bubbles in the small holes 3 and the air bubbles generated inside the small holes 3. can be removed. Therefore, in the printed circuit board 2, a predetermined no-clean film is reliably formed on the inner periphery of all the small holes 3.
その後、小孔３内のメツキ膜形成が終了すると、搬送装
置６の搬送棒５が搬送を開始し、プリント基板２が収容
体１１から引き上げられ、次工程の処理のために搬送さ
れる。Thereafter, when the formation of the plating film in the small holes 3 is completed, the transport rod 5 of the transport device 6 starts transporting, and the printed circuit board 2 is pulled up from the container 11 and transported for the next process.
（発明の効果）
以」二のように本発明によれば、プリント基板を吊した
ままの状態で処理液槽内において振動できるようにした
ので、プリント基板を吊したままの状態でその小孔にメ
ツキ膜を確実に形成することができる。従って、本発明
は、プリント基板を搬送装置からいちいち分離せずに搬
送しながら製造する工程ラインに適用することができる
。(Effects of the Invention) As described in 2 below, according to the present invention, it is possible to vibrate the printed circuit board in the processing liquid tank while it is suspended, so that the small holes of the printed circuit board can be vibrated while the printed circuit board is suspended. A plating film can be reliably formed. Therefore, the present invention can be applied to a process line in which printed circuit boards are manufactured while being transported without being separated from the transport device one by one.
４、図面の１１ＩＩｔＪ！Ｌな説明
第１図は本発明の実施例の断面図、第２図は木発明の他
の実施例の断面図である。4. Drawing 11IItJ! L Description FIG. 1 is a sectional view of an embodiment of the present invention, and FIG. 2 is a sectional view of another embodiment of the wooden invention.
１．ｔｏは処理液槽、２はプリント基板、３は小孔、４
は吊し片、６は搬送装置、９．１３は振動発生器、１１
は収容体。1. to is a processing liquid tank, 2 is a printed circuit board, 3 is a small hole, 4
is a hanging piece, 6 is a conveyance device, 9.13 is a vibration generator, 11
is a containment body.
特許 出願人 株式会社プランテックス代 理 人
牧 舌部（ほか３名）第１図Patent applicant Plantex Co., Ltd. Agent
Maki Tobe (and 3 others) Figure 1
Claims (2)
材と、 その吊し部材に吊してプリント基板を浸漬 する処理液槽と、 その処理液槽を振動する振動発生器とから なり、 前記処理液槽が振動するときに、その処理 液槽の内面が前記プリント基板に接触できるようにして
なるプリント基板製造装置。1. It consists of a hanging member for freely hanging a printed circuit board having small holes, a processing liquid tank for suspending from the hanging member and immersing the printed circuit board, and a vibration generator for vibrating the processing liquid tank. A printed circuit board manufacturing apparatus which allows the inner surface of the processing liquid tank to come into contact with the printed circuit board when the liquid tank vibrates.
材と、 その吊し部材に吊してプリント基板を浸漬 する処理液槽と、 前記プリント基板を前記処理液槽に浸漬し たときにそのプリント基板を収容する収容体と、 その収容体を振動する振動発生器とからな り、 前記収容体が振動するときに、その収容体 が前記プリント基板に接触できるようにしてなるプリン
ト基板製造装置。2. A hanging member for freely hanging a printed circuit board having a small hole; a processing liquid tank for suspending the printed circuit board from the hanging member and immersing the printed circuit board in the processing liquid tank; What is claimed is: 1. A printed circuit board manufacturing apparatus comprising: a container for accommodating a container; and a vibration generator for vibrating the container, the container being able to come into contact with the printed circuit board when the container vibrates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8961288A JPH01260887A (en) | 1988-04-12 | 1988-04-12 | Apparatus for manufacturing printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8961288A JPH01260887A (en) | 1988-04-12 | 1988-04-12 | Apparatus for manufacturing printed board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01260887A true JPH01260887A (en) | 1989-10-18 |
| JPH0522400B2 JPH0522400B2 (en) | 1993-03-29 |
Family
ID=13975572
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8961288A Granted JPH01260887A (en) | 1988-04-12 | 1988-04-12 | Apparatus for manufacturing printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01260887A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH081114A (en) * | 1994-06-17 | 1996-01-09 | Tousei Kk | Cleaning device |
-
1988
- 1988-04-12 JP JP8961288A patent/JPH01260887A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH081114A (en) * | 1994-06-17 | 1996-01-09 | Tousei Kk | Cleaning device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0522400B2 (en) | 1993-03-29 |
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