JPS62154678U - - Google Patents
Info
- Publication number
- JPS62154678U JPS62154678U JP4127286U JP4127286U JPS62154678U JP S62154678 U JPS62154678 U JP S62154678U JP 4127286 U JP4127286 U JP 4127286U JP 4127286 U JP4127286 U JP 4127286U JP S62154678 U JPS62154678 U JP S62154678U
- Authority
- JP
- Japan
- Prior art keywords
- crossing over
- conductive pattern
- conductive
- insulating pattern
- pattern lines
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Description
第１図は本考案の１実施例に係る厚膜多層印刷
回路の要部平面図、第２図および第３図は従来例
に係り、第２図は第１図と対応する要部平面図、
第３図は導電パターン線の短絡を示す説明図であ
る。
１……絶縁基板、２……下部電極、２ａ……接
続ランド、２ｂ……連結パターン、３……接続ラ
ンド、４……絶縁パターン、４ａ……窓、４ｂ…
…延長部、５Ａ，５Ｂ……導電パターン線、６Ａ
，６Ｂ……ＬＥＤチツプ。
FIG. 1 is a plan view of the main parts of a thick film multilayer printed circuit according to an embodiment of the present invention, FIGS. 2 and 3 are related to the conventional example, and FIG. 2 is a plan view of the main parts corresponding to FIG. 1. ,
FIG. 3 is an explanatory diagram showing a short circuit in a conductive pattern line. DESCRIPTION OF SYMBOLS 1... Insulating substrate, 2... Lower electrode, 2a... Connection land, 2b... Connection pattern, 3... Connection land, 4... Insulating pattern, 4a... Window, 4b...
...Extension part, 5A, 5B...Conductive pattern wire, 6A
, 6B...LED chip.
Claims (1)
導電パターン線を平行且つ近接させてクロスオー
バーさせ、該２本の導電パターン線をクロスオー
バー後一定位置で左右に散開するよう折曲げて形
成する構成において、前記絶縁パターンを、前記
２本の導電パターンが左右に折れる箇所の下側ま
で少なくとも延長したことを特徴とする厚膜多層
印刷回路。 Formed by crossing over two conductive pattern lines in parallel and close to each other on the lower electrode covered with an insulating pattern, and bending the two conductive pattern lines to spread out to the left and right at a certain position after crossing over. A thick film multilayer printed circuit according to the present invention, wherein the insulating pattern extends at least to a lower side of a point where the two conductive patterns are folded to the left and right.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4127286U JPS62154678U (en) | 1986-03-20 | 1986-03-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4127286U JPS62154678U (en) | 1986-03-20 | 1986-03-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62154678U true JPS62154678U (en) | 1987-10-01 |
Family
ID=30856116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4127286U Pending JPS62154678U (en) | 1986-03-20 | 1986-03-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62154678U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57160198A (en) * | 1981-03-27 | 1982-10-02 | Nippon Electric Co | Crossover insulating layer structure for thick film multilayer circuit board |
| JPS58148498A (en) * | 1982-02-26 | 1983-09-03 | 住友電気工業株式会社 | Yield improving pattern for ceramic thick film printed circuit board |
-
1986
- 1986-03-20 JP JP4127286U patent/JPS62154678U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57160198A (en) * | 1981-03-27 | 1982-10-02 | Nippon Electric Co | Crossover insulating layer structure for thick film multilayer circuit board |
| JPS58148498A (en) * | 1982-02-26 | 1983-09-03 | 住友電気工業株式会社 | Yield improving pattern for ceramic thick film printed circuit board |
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