JPS60169869U - multilayer printed wiring board - Google Patents

multilayer printed wiring board

Info

Publication number
JPS60169869U
JPS60169869U JP1984057993U JP5799384U JPS60169869U JP S60169869 U JPS60169869 U JP S60169869U JP 1984057993 U JP1984057993 U JP 1984057993U JP 5799384 U JP5799384 U JP 5799384U JP S60169869 U JPS60169869 U JP S60169869U
Authority
JP
Japan
Prior art keywords
wiring board
multilayer printed
printed wiring
wiring
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984057993U
Other languages
Japanese (ja)
Inventor
明渡　晃弘
恵 谷本
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Priority to JP1984057993U priority Critical patent/JPS60169869U/en
Publication of JPS60169869U publication Critical patent/JPS60169869U/en
Pending legal-status Critical Current

Links

Landscapes

  • Multi-Conductor Connections (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の多層プリント配線基板の一実施例を示
す断面斜視図、第２図は同配線基板の他の実施例を示す
断面斜視図、第３図及び第４図は同配線基板の使用例を
示す斜視図、第５図は従来の多層プリント配線基板の断
面斜視図である。 ３・・・配線基板、４，５・・・配線パターン、４ａｖ
５ａ・・・接続パターン、７・・・接触片、８・・・コ
ネクタ。Fig. 1 is a cross-sectional perspective view showing one embodiment of the multilayer printed wiring board of the present invention, Fig. 2 is a cross-sectional perspective view showing another embodiment of the same wiring board, and Figs. 3 and 4 are the same wiring board. FIG. 5 is a cross-sectional perspective view of a conventional multilayer printed wiring board. 3... Wiring board, 4, 5... Wiring pattern, 4av
5a...Connection pattern, 7...Contact piece, 8...Connector.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 少なくとも２層以上の配線パターンを形成し、各層の配
線パターンの一部に配線基板端部へ導出した接続パター
ンを設け、これに所望の端子間を短絡したコネクタを接
合し、各配線パターン間を電気的に接続することを特徴
とする多層プリント配線基板。At least two or more layers of wiring patterns are formed, a connection pattern led out to the end of the wiring board is provided in a part of the wiring pattern of each layer, and a connector short-circuited between the desired terminals is joined to this, and the wiring pattern is connected between each wiring pattern. A multilayer printed wiring board characterized by electrical connection.
JP1984057993U 1984-04-19 1984-04-19 multilayer printed wiring board Pending JPS60169869U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984057993U JPS60169869U (en) 1984-04-19 1984-04-19 multilayer printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984057993U JPS60169869U (en) 1984-04-19 1984-04-19 multilayer printed wiring board

Publications (1)

Publication Number Publication Date
JPS60169869U true JPS60169869U (en) 1985-11-11

Family

ID=30583059

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984057993U Pending JPS60169869U (en) 1984-04-19 1984-04-19 multilayer printed wiring board

Country Status (1)

Country Link
JP (1) JPS60169869U (en)

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