JPS59187171U - multilayer flexible circuit board - Google Patents

multilayer flexible circuit board

Info

Publication number
JPS59187171U
JPS59187171U JP8216983U JP8216983U JPS59187171U JP S59187171 U JPS59187171 U JP S59187171U JP 8216983 U JP8216983 U JP 8216983U JP 8216983 U JP8216983 U JP 8216983U JP S59187171 U JPS59187171 U JP S59187171U
Authority
JP
Japan
Prior art keywords
circuit board
flexible circuit
multilayer flexible
conductor pattern
patterns
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8216983U
Other languages
Japanese (ja)
Other versions
JPS6236317Y2 (en
Inventor
博文 松本
Original Assignee
日本メクトロン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本メクトロン株式会社 filed Critical 日本メクトロン株式会社
Priority to JP8216983U priority Critical patent/JPS59187171U/en
Publication of JPS59187171U publication Critical patent/JPS59187171U/en
Application granted granted Critical
Publication of JPS6236317Y2 publication Critical patent/JPS6236317Y2/ja
Granted legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図及び第２図は本考案に係る多層フレキシブル回路
基板の一実施例を概念的に示す斜視図及び断面図、第３
図は他の実施例を示す概念的な断面図である。 １、　２．　１４．　１５．　１６．　１７．　１８・
・・導体パターン、ＩＡ、　　２Ｂ、　　１４Ａ、　　
１６Ａ、　　１８Ｂ。 １８Ｃ・・・接続面、２Ａ、１８Ａ・・・接続部、３，
４゜５、　８．　９．　１０．　１１．　１２．　１３
・・・絶縁性ベース部材、７．　２０．　２１・・・接
続材。1 and 2 are a perspective view and a sectional view conceptually showing an embodiment of the multilayer flexible circuit board according to the present invention, and FIG.
The figure is a conceptual sectional view showing another embodiment. 1, 2. 14. 15. 16. 17. 18・
・・Conductor pattern, IA, 2B, 14A,
16A, 18B. 18C... Connection surface, 2A, 18A... Connection part, 3,
4゜5, 8. 9. 10. 11. 12. 13
...Insulating base member, 7. 20. 21...Connecting material.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁部材を介して積層した複数の導体パターンの所要部
を相互に接続して導通させる多層フレキシブル回路基板
において、一方の導体パターンに接続しようとする他の
導体パターンの接続すべき部分を前記一方の導体パター
ンの接続すべき部分に向けて屈曲させて両溝体パターン
の前記各接続すべき部分を重ね合せ、前記重ね合せた部
分を接続したことを特徴とする多層フレキシブル回路基
板。In a multilayer flexible circuit board in which required parts of a plurality of conductor patterns laminated through insulating members are connected to each other for conduction, the part of the conductor pattern to be connected to one conductor pattern is connected to the other conductor pattern. A multilayer flexible circuit board characterized in that the conductive patterns are bent toward the connecting portions, the respective connecting portions of both groove body patterns are overlapped, and the overlapping portions are connected.
JP8216983U 1983-05-31 1983-05-31 multilayer flexible circuit board Granted JPS59187171U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8216983U JPS59187171U (en) 1983-05-31 1983-05-31 multilayer flexible circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8216983U JPS59187171U (en) 1983-05-31 1983-05-31 multilayer flexible circuit board

Publications (2)

Publication Number Publication Date
JPS59187171U true JPS59187171U (en) 1984-12-12
JPS6236317Y2 JPS6236317Y2 (en) 1987-09-16

Family

ID=30212121

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8216983U Granted JPS59187171U (en) 1983-05-31 1983-05-31 multilayer flexible circuit board

Country Status (1)

Country Link
JP (1) JPS59187171U (en)

Also Published As

Publication number Publication date
JPS6236317Y2 (en) 1987-09-16

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