JPS6085860U - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPS6085860U JPS6085860U JP17911883U JP17911883U JPS6085860U JP S6085860 U JPS6085860 U JP S6085860U JP 17911883 U JP17911883 U JP 17911883U JP 17911883 U JP17911883 U JP 17911883U JP S6085860 U JPS6085860 U JP S6085860U
- Authority
- JP
- Japan
- Prior art keywords
- printed board
- hole
- bonded
- insulating board
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は実施例の斜視図1、第2図は第1図のものを目
的とする配線にした一例の斜視図。第3図は第2図のも
のの一断面図である。第4図は別の実施例の斜視図。第
5図は第4区のものを目的とする配線にした一例の斜視
図。第6図は第5図のものの一断面で電子部品を取りつ
けた例である。
第7図は第4図の隣接する穴部につながる導電はく9を
ループ状にした例。第8図は第4図の平らな絶縁板6の
隣接する穴部につながる部分付近に溝をつけ、隣接する
穴部につながる導電はく9は空間に浮いている例を示す
。
1・・・絶縁板、2・・・電子部品の接続電線の入る穴
、−3・・・周辺より一段高い部分、4・・・導電はく
、5・・・隣接する穴部につながる導電はく、6・・・
平らな絶縁板、7・・・第1図の導電はくと同様のもの
、8・・・電子部品の接続電線の入る穴、9・・・隣接
する穴部につながる導電は(。FIG. 1 is a perspective view 1 of an embodiment, and FIG. 2 is a perspective view of an example in which the intended wiring is the same as that shown in FIG. FIG. 3 is a cross-sectional view of the one shown in FIG. 2. FIG. 4 is a perspective view of another embodiment. FIG. 5 is a perspective view of an example of wiring intended for the fourth section. FIG. 6 is a cross section of the one shown in FIG. 5, showing an example in which electronic components are attached. FIG. 7 shows an example in which the conductive foil 9 connected to adjacent holes in FIG. 4 is formed into a loop. FIG. 8 shows an example in which a groove is formed near the portion of the flat insulating plate 6 shown in FIG. 4 that connects to the adjacent hole, and the conductive foil 9 that connects to the adjacent hole floats in space. 1... Insulating plate, 2... Hole for connecting electric wire of electronic component, -3... Part one step higher than surrounding area, 4... Conductive foil, 5... Conductive part connected to adjacent hole part Haku, 6...
A flat insulating plate, 7... Something similar to the conductive foil shown in Figure 1, 8... A hole for the connecting wire of an electronic component, 9... The conductive material connected to the adjacent hole is (.
Claims (1)
は絶縁板に接合しているが、隣接する穴部につながる導
電は(の一部又は全部が絶縁板に接合していない万能型
プリント基板。(1) The conductivity around the hole where the connecting wire of the electronic component is inserted is (
is bonded to the insulating board, but the conductive wire connected to the adjacent hole is a universal printed circuit board (part or all of which is not bonded to the insulating board).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17911883U JPS6085860U (en) | 1983-11-19 | 1983-11-19 | Printed board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17911883U JPS6085860U (en) | 1983-11-19 | 1983-11-19 | Printed board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6085860U true JPS6085860U (en) | 1985-06-13 |
Family
ID=30388709
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17911883U Pending JPS6085860U (en) | 1983-11-19 | 1983-11-19 | Printed board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6085860U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6277342B1 (en) * | 2016-11-04 | 2018-02-07 | 達也 宮崎 | Metal foil substrate and pattern forming method for electronic circuit and apparatus using the same |
-
1983
- 1983-11-19 JP JP17911883U patent/JPS6085860U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6277342B1 (en) * | 2016-11-04 | 2018-02-07 | 達也 宮崎 | Metal foil substrate and pattern forming method for electronic circuit and apparatus using the same |
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