JPS62151776U - - Google Patents
Info
- Publication number
- JPS62151776U JPS62151776U JP4043786U JP4043786U JPS62151776U JP S62151776 U JPS62151776 U JP S62151776U JP 4043786 U JP4043786 U JP 4043786U JP 4043786 U JP4043786 U JP 4043786U JP S62151776 U JPS62151776 U JP S62151776U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor laser
- cooling element
- heat dissipation
- fixed
- thermoelectric cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 claims 2
- 230000005855 radiation Effects 0.000 description 3
- 238000009529 body temperature measurement Methods 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Description
第１図は本考案の実施例の概略横断面図、第２
図は従来の基本構造を示す斜視図、第３図は第２
図を説明補助する概略横断面図、第４図は第１図
のモジユールの装置への実装例を示す概略斜視図
である。
１……半導体レーザ素子、２……レーザ出力モ
ニタ素子、３……光フアイバ、４……温度計測用
サーミスタ、５……ブロツク、６……電子冷却素
子、ＤＩＰ形パツケージ、８……放熱用フランジ
、９……中継端子、１０……ヒートシンク、１１
……伝熱、１２……蓋、２０……半導体レーザ素
子、２１……レーザ出力モニタ素子、２２……光
フアイバ、２３……温度計測用サーミスタ、２４
……ブロツク、２５……電子冷却素子、２６……
吸熱面、２７……放熱用フランジ、２８……内面
、２９……放熱面、３０……ＤＩＰ形パツケージ
、４０……半導体レーザモジユール、４１……回
路基板、４２……装置、４３……放熱器、４４…
…光コネクタ。
Figure 1 is a schematic cross-sectional view of an embodiment of the present invention;
The figure is a perspective view showing the conventional basic structure, and Figure 3 is the second
FIG. 4 is a schematic cross-sectional view to help explain the figures, and FIG. 4 is a schematic perspective view showing an example of mounting the module of FIG. 1 on an apparatus. 1...Semiconductor laser element, 2...Laser output monitor element, 3...Optical fiber, 4...Thermistor for temperature measurement, 5...Block, 6...Electronic cooling element, DIP type package, 8...For heat radiation Flange, 9...Relay terminal, 10...Heat sink, 11
... Heat transfer, 12 ... Lid, 20 ... Semiconductor laser element, 21 ... Laser output monitor element, 22 ... Optical fiber, 23 ... Thermistor for temperature measurement, 24
...Block, 25...Electronic cooling element, 26...
Heat absorption surface, 27... Heat radiation flange, 28... Inner surface, 29... Heat radiation surface, 30... DIP type package, 40... Semiconductor laser module, 41... Circuit board, 42... Device, 43... Heat sink, 44...
...Optical connector.
Claims (1)
ージ内に、電子冷却素子を介して半導体レーザ素
子を固定した半導体レーザモジユールにおいて、 前記電子冷却素子が前記放熱用フランジの内面
に固定されていることを特徴とする半導体レーザ
モジユール。[Claims for Utility Model Registration] A semiconductor laser module in which a semiconductor laser element is fixed in a DIP type package having a heat dissipation flange on the side surface via a thermoelectric cooling element, wherein the thermoelectric cooling element is attached to the inner surface of the heat dissipation flange. A semiconductor laser module characterized by being fixed to.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4043786U JPS62151776U (en) | 1986-03-18 | 1986-03-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4043786U JPS62151776U (en) | 1986-03-18 | 1986-03-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62151776U true JPS62151776U (en) | 1987-09-26 |
Family
ID=30854517
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4043786U Pending JPS62151776U (en) | 1986-03-18 | 1986-03-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62151776U (en) |
-
1986
- 1986-03-18 JP JP4043786U patent/JPS62151776U/ja active Pending
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