JPS6214935U - - Google Patents
Info
- Publication number
- JPS6214935U JPS6214935U JP10472185U JP10472185U JPS6214935U JP S6214935 U JPS6214935 U JP S6214935U JP 10472185 U JP10472185 U JP 10472185U JP 10472185 U JP10472185 U JP 10472185U JP S6214935 U JPS6214935 U JP S6214935U
- Authority
- JP
- Japan
- Prior art keywords
- overcurrent protection
- semiconductor element
- protection function
- external lead
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 10
- 238000000034 method Methods 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Fuses (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10472185U JPS6214935U (US06650917-20031118-M00005.png) | 1985-07-09 | 1985-07-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10472185U JPS6214935U (US06650917-20031118-M00005.png) | 1985-07-09 | 1985-07-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6214935U true JPS6214935U (US06650917-20031118-M00005.png) | 1987-01-29 |
Family
ID=30978479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10472185U Pending JPS6214935U (US06650917-20031118-M00005.png) | 1985-07-09 | 1985-07-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6214935U (US06650917-20031118-M00005.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012513078A (ja) * | 2008-12-22 | 2012-06-07 | オーストリアマイクロシステムズ アクチエンゲゼルシャフト | 半導体チップのパッケージおよびこの製造方法 |
| WO2018079409A1 (ja) * | 2016-10-26 | 2018-05-03 | 三菱電機株式会社 | 樹脂封止型半導体装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58218139A (ja) * | 1982-06-14 | 1983-12-19 | Toshiba Corp | ヒユ−ズ切断回路 |
-
1985
- 1985-07-09 JP JP10472185U patent/JPS6214935U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58218139A (ja) * | 1982-06-14 | 1983-12-19 | Toshiba Corp | ヒユ−ズ切断回路 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012513078A (ja) * | 2008-12-22 | 2012-06-07 | オーストリアマイクロシステムズ アクチエンゲゼルシャフト | 半導体チップのパッケージおよびこの製造方法 |
| WO2018079409A1 (ja) * | 2016-10-26 | 2018-05-03 | 三菱電機株式会社 | 樹脂封止型半導体装置 |
| JP2018073899A (ja) * | 2016-10-26 | 2018-05-10 | 三菱電機株式会社 | 樹脂封止型半導体装置 |
