JPS62149140A - Manufacture of resin sealed semiconductor device - Google Patents

Abstract

PURPOSE:To facilitate the removal of burr, by forming a cut-out part in the burr, and removing the burr along the cut-out part. CONSTITUTION:A groove 5a is provided so that the groove is contacted with a boundary surface between a package main body 2 and burr 1 and both end parts of the groove 5a do not reach the inside of a lead 3 from the side surface of the outer lead 3. When a tie bar 4 is removed, the burr 1 is removed along the groove 5a at the same time. Thus the removal of the burr 1 is readily performed.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for manufacturing a semi-V4 package, and particularly to deburring a plastic package.

[Conventional technology]

The sixth figure is a perspective view of a resin-sealed semiconductor device circuit device, and the shaded area is a partial sectional view of a conventional resin-sealed semiconductor integrated circuit device. (1) refers to burrs generated in the space formed by the external leads (3) led out from the package body and the tie bars (4) connecting them, in addition to the resin sealing.

[Problem that the invention attempts to solve]

Conventional resin-sealed semiconductor integrated circuit devices, such as those that handle plastic molding, have problems such as some of the burrs remaining near the package body when removing burrs that occur during resin-sealing molding. Ivy.

This invention was made to solve the problems of conventional resin-sealed semiconductor integrated circuit devices such as the J: grip, and aims to produce a resin-sealed semiconductor device without burrs.

[Failure to solve the problem]

In this invention, a notch is formed in the burr, and the burr is removed along the notch.

[For production]

In this invention, the burr is easily removed from the body along the notch.

〔Example〕

FIG. 1 is a sectional view showing an embodiment of the present invention, and the same reference numerals as the sixth factor indicate the same elements.

As shown in Figure 1, both ends of the lag are in contact with the interface between the package body (2) and the burr +1), and the outer leads (3)
so that it reaches the inside of the external lead (3) from the side of the
A groove (6a) is formed. Next, the burr (1) is removed along the groove (5a) at the same time as the VC and tie bar (4) are removed.

In Okuki Jitsu'Ib, the tie bar (4) and burr (1) were removed at the same time, but the tie bar (4) may be removed after the burr (1) is removed.

Saba 2 Figure 1 = shows another example of this invention with a groove (5
The cross-sectional shape of b) is U-shaped.

FIG. 8 shows another embodiment of the present invention, in which the groove (5
The cross-sectional shape of c) is made concave.

Figure 4 shows another embodiment of this invention! Indicates 1, 1
Grooves (5d, 5e) are provided on both the front and back surfaces of the burr described in iii.

FIG. 5 shows another embodiment of the present invention, in which a plurality of grooves (5f, 5g) are arranged at a position in contact with a surface t connecting the protruding parts of the external lead (3) and a position in contact with a tie bar (4). It was established in

Although the position of the groove has been explained in the embodiment, it may be placed in another position (or the groove may be provided in the center of the burr).

〔Effect of the invention〕

As described above, in this invention, a notch is formed in the burr, and the burr is removed along the notch, so that the burr can be easily removed.

[Brief explanation of drawings]

The first factor is FIG. 2, which is a sectional view showing an embodiment of the present invention.
8, 4, and 5 are cross-sectional views showing other embodiments of the present invention, and FIG. 6 is a resin-sealed semiconductor integrated circuit device manufactured by a conventional method for manufacturing a resin-sealed semiconductor integrated circuit device. This is a perspective view of a fixed type semiconductor integrated circuit device. In the figure, (1) is a burr, (2) is a package body, (3) 1j external lead, (4) is a tie bar, and (5a) to (5g) are grooves. . In the drawings, the same reference numerals indicate the same or corresponding parts.

Claims (9)

[Claims] (1) A resin characterized in that a notch is formed in a burr generated between a plurality of external leads led out from a main body of a resin-sealed semiconductor device, and the burr is removed from the main body along this notch. A method for manufacturing a sealed semiconductor device. (2) Claim 1, characterized in that the notch is provided at a position adjacent to the external lead-out lead protrusion of the main body.
A method for manufacturing a resin-sealed semiconductor device as described in 1. (3) The method for manufacturing a resin-sealed semiconductor device according to claim 1, wherein the cutout portion is provided on both the front and back surfaces of the burr. (4) The method for manufacturing a resin-sealed semiconductor device according to claim 1, wherein the notch is provided at a predetermined distance from the external lead projection of the main body. (5) The method for manufacturing a resin-sealed semiconductor device according to claim 1, wherein the cross-sectional shape of the notch is a V-shaped groove. (6) The method for manufacturing a resin-sealed semiconductor device according to claim 1, wherein the cross-sectional shape of the notch is a U-shaped groove. (7) The method for manufacturing a resin-sealed semiconductor device according to claim 1, wherein the notch is formed by providing a protrusion on a resin-sealed mold. (8) The method for manufacturing a resin-sealed semiconductor device according to claim 1, wherein the notch is formed by machining. (9) The method for manufacturing a resin-sealed semiconductor device according to claim 1, wherein the cutout is formed by laser processing.