JPS62147337A - 電子部品パッケージの密閉度試験方法 - Google Patents
電子部品パッケージの密閉度試験方法Info
- Publication number
- JPS62147337A JPS62147337A JP28418785A JP28418785A JPS62147337A JP S62147337 A JPS62147337 A JP S62147337A JP 28418785 A JP28418785 A JP 28418785A JP 28418785 A JP28418785 A JP 28418785A JP S62147337 A JPS62147337 A JP S62147337A
- Authority
- JP
- Japan
- Prior art keywords
- package
- fluid
- airtightness
- cavity
- sensing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012360 testing method Methods 0.000 title claims description 41
- 238000000034 method Methods 0.000 title claims description 32
- 239000012530 fluid Substances 0.000 claims description 73
- 238000001514 detection method Methods 0.000 claims description 21
- 238000010521 absorption reaction Methods 0.000 claims description 9
- 238000009835 boiling Methods 0.000 claims description 9
- 238000010998 test method Methods 0.000 claims description 9
- 229910052731 fluorine Inorganic materials 0.000 claims description 6
- 239000011737 fluorine Substances 0.000 claims description 6
- 230000000704 physical effect Effects 0.000 claims description 5
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 4
- 238000010790 dilution Methods 0.000 claims description 3
- 239000012895 dilution Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000001704 evaporation Methods 0.000 claims 2
- 230000008020 evaporation Effects 0.000 claims 2
- 238000007599 discharging Methods 0.000 claims 1
- 239000007788 liquid Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 238000007789 sealing Methods 0.000 description 4
- 229910001369 Brass Inorganic materials 0.000 description 3
- 239000010951 brass Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 238000005429 filling process Methods 0.000 description 3
- 238000004377 microelectronic Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005264 electron capture Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- -1 fluorine carbides Chemical class 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Landscapes
- Examining Or Testing Airtightness (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28418785A JPS62147337A (ja) | 1985-12-17 | 1985-12-17 | 電子部品パッケージの密閉度試験方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28418785A JPS62147337A (ja) | 1985-12-17 | 1985-12-17 | 電子部品パッケージの密閉度試験方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62147337A true JPS62147337A (ja) | 1987-07-01 |
| JPH0464572B2 JPH0464572B2 (enrdf_load_stackoverflow) | 1992-10-15 |
Family
ID=17675298
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28418785A Granted JPS62147337A (ja) | 1985-12-17 | 1985-12-17 | 電子部品パッケージの密閉度試験方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62147337A (enrdf_load_stackoverflow) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007218745A (ja) * | 2006-02-16 | 2007-08-30 | Denso Corp | 気密漏れ検査方法及び装置 |
| JP2008032658A (ja) * | 2006-07-31 | 2008-02-14 | Kyocera Kinseki Corp | パッケージの気密検査方法と気密検査装置 |
| JP2009085678A (ja) * | 2007-09-28 | 2009-04-23 | Akim Kk | センサ用リーク検査装置およびセンサのリーク検査方法 |
| JP6381854B1 (ja) * | 2017-10-10 | 2018-08-29 | 三菱電機株式会社 | 半導体装置の試験方法、および半導体装置の製造方法 |
| JP6381848B1 (ja) * | 2018-06-06 | 2018-08-29 | 三菱電機株式会社 | 半導体装置の試験方法、および半導体装置の製造方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5091378A (enrdf_load_stackoverflow) * | 1973-12-12 | 1975-07-22 | ||
| JPS56157659U (enrdf_load_stackoverflow) * | 1980-04-22 | 1981-11-25 | ||
| JPS58140621A (ja) * | 1982-02-16 | 1983-08-20 | Rigaku Denki Kogyo Kk | 放射線検出用シンチレ−タ検査装置 |
| JPS6010131A (ja) * | 1983-06-30 | 1985-01-19 | Fujitsu Ltd | 漏洩ガスの検知方法 |
| JPS60176156U (ja) * | 1984-04-30 | 1985-11-21 | 株式会社島津製作所 | リ−クテスト装置 |
-
1985
- 1985-12-17 JP JP28418785A patent/JPS62147337A/ja active Granted
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5091378A (enrdf_load_stackoverflow) * | 1973-12-12 | 1975-07-22 | ||
| JPS56157659U (enrdf_load_stackoverflow) * | 1980-04-22 | 1981-11-25 | ||
| JPS58140621A (ja) * | 1982-02-16 | 1983-08-20 | Rigaku Denki Kogyo Kk | 放射線検出用シンチレ−タ検査装置 |
| JPS6010131A (ja) * | 1983-06-30 | 1985-01-19 | Fujitsu Ltd | 漏洩ガスの検知方法 |
| JPS60176156U (ja) * | 1984-04-30 | 1985-11-21 | 株式会社島津製作所 | リ−クテスト装置 |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007218745A (ja) * | 2006-02-16 | 2007-08-30 | Denso Corp | 気密漏れ検査方法及び装置 |
| JP2008032658A (ja) * | 2006-07-31 | 2008-02-14 | Kyocera Kinseki Corp | パッケージの気密検査方法と気密検査装置 |
| JP2009085678A (ja) * | 2007-09-28 | 2009-04-23 | Akim Kk | センサ用リーク検査装置およびセンサのリーク検査方法 |
| JP6381854B1 (ja) * | 2017-10-10 | 2018-08-29 | 三菱電機株式会社 | 半導体装置の試験方法、および半導体装置の製造方法 |
| WO2019073519A1 (ja) * | 2017-10-10 | 2019-04-18 | 三菱電機株式会社 | 半導体装置の試験方法、および半導体装置の製造方法 |
| JP6381848B1 (ja) * | 2018-06-06 | 2018-08-29 | 三菱電機株式会社 | 半導体装置の試験方法、および半導体装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0464572B2 (enrdf_load_stackoverflow) | 1992-10-15 |
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