JPS6214686Y2 - - Google Patents
Info
- Publication number
- JPS6214686Y2 JPS6214686Y2 JP11437482U JP11437482U JPS6214686Y2 JP S6214686 Y2 JPS6214686 Y2 JP S6214686Y2 JP 11437482 U JP11437482 U JP 11437482U JP 11437482 U JP11437482 U JP 11437482U JP S6214686 Y2 JPS6214686 Y2 JP S6214686Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- leads
- resin material
- substrate
- molten resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 62
- 229920005989 resin Polymers 0.000 claims description 62
- 239000000463 material Substances 0.000 claims description 26
- 238000000576 coating method Methods 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 19
- 239000011248 coating agent Substances 0.000 claims description 16
- 238000007598 dipping method Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11437482U JPS5918440U (ja) | 1982-07-27 | 1982-07-27 | 樹脂コ−テイング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11437482U JPS5918440U (ja) | 1982-07-27 | 1982-07-27 | 樹脂コ−テイング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5918440U JPS5918440U (ja) | 1984-02-04 |
| JPS6214686Y2 true JPS6214686Y2 (it) | 1987-04-15 |
Family
ID=30264411
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11437482U Granted JPS5918440U (ja) | 1982-07-27 | 1982-07-27 | 樹脂コ−テイング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5918440U (it) |
-
1982
- 1982-07-27 JP JP11437482U patent/JPS5918440U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5918440U (ja) | 1984-02-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE2755926A1 (de) | Schaltungsplatine sowie verfahren zu ihrer herstellung | |
| EP0119272B1 (en) | Method and device for soldering printed board | |
| JPS6214686Y2 (it) | ||
| DE19907295C1 (de) | Verfahren zur Montage elektronischer und/oder optischer Bauelemente und Baugruppen auf der Rückseite einseitig bestückter flexibler Leiterplatten | |
| US20070119911A1 (en) | Method of forming a composite standoff on a circuit board | |
| JPS6010692A (ja) | プリント配線板 | |
| JPS6214687Y2 (it) | ||
| WO1987004008A1 (en) | Lead finishing for a surface mount package | |
| JPS5853890A (ja) | 電子部品のはんだ付け方法 | |
| JPH03241813A (ja) | チップ型電子部品の外装方法 | |
| JPH098423A (ja) | 回路基板およびその製造方法 | |
| JPS6339117B2 (it) | ||
| JP2765373B2 (ja) | プリント基板 | |
| JPS59145592A (ja) | 印刷配線基板への電子部品の取付法 | |
| JPS5975690A (ja) | 印刷配線板への電子部品の実装方法 | |
| JP2554693Y2 (ja) | プリント基板 | |
| JPH0710976U (ja) | 基板のレジスト塗布構造 | |
| JPH03123096A (ja) | ハイブリッドｉｃの製造方法およびその構造 | |
| JPS635260Y2 (it) | ||
| EP0386709A2 (de) | Edelmetallfreie Chipleiterbrücke und Verfahren zu ihrer Herstellung | |
| JPH02226674A (ja) | 混成集積回路モジュール及びその製造方法 | |
| JP3443943B2 (ja) | 電子回路部品の製造方法 | |
| JPH02142196A (ja) | プリント回路基板及び回路素子の実装方法 | |
| JPS61199642A (ja) | 混成集積回路の外装方法 | |
| JPH09232744A (ja) | プリント配線板の製造方法 |