JPS62145827A - 電子部品の接続方法 - Google Patents

電子部品の接続方法

Info

Publication number
JPS62145827A
JPS62145827A JP28822785A JP28822785A JPS62145827A JP S62145827 A JPS62145827 A JP S62145827A JP 28822785 A JP28822785 A JP 28822785A JP 28822785 A JP28822785 A JP 28822785A JP S62145827 A JPS62145827 A JP S62145827A
Authority
JP
Japan
Prior art keywords
anisotropic conductive
conductive adhesive
wiring pattern
overcoat layer
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP28822785A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0424859B2 (enExample
Inventor
Kazuhito Ozawa
小沢　一仁
Ichiro Obara
一郎 小原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP28822785A priority Critical patent/JPS62145827A/ja
Publication of JPS62145827A publication Critical patent/JPS62145827A/ja
Publication of JPH0424859B2 publication Critical patent/JPH0424859B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP28822785A 1985-12-20 1985-12-20 電子部品の接続方法 Granted JPS62145827A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28822785A JPS62145827A (ja) 1985-12-20 1985-12-20 電子部品の接続方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28822785A JPS62145827A (ja) 1985-12-20 1985-12-20 電子部品の接続方法

Publications (2)

Publication Number Publication Date
JPS62145827A true JPS62145827A (ja) 1987-06-29
JPH0424859B2 JPH0424859B2 (enExample) 1992-04-28

Family

ID=17727475

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28822785A Granted JPS62145827A (ja) 1985-12-20 1985-12-20 電子部品の接続方法

Country Status (1)

Country Link
JP (1) JPS62145827A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5386624A (en) * 1993-07-06 1995-02-07 Motorola, Inc. Method for underencapsulating components on circuit supporting substrates
US5918363A (en) * 1996-05-20 1999-07-06 Motorola, Inc. Method for marking functional integrated circuit chips with underfill material
JP2005093826A (ja) * 2003-09-18 2005-04-07 Ricoh Co Ltd 導電性接着剤による接続構造体及びその製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5386624A (en) * 1993-07-06 1995-02-07 Motorola, Inc. Method for underencapsulating components on circuit supporting substrates
US5918363A (en) * 1996-05-20 1999-07-06 Motorola, Inc. Method for marking functional integrated circuit chips with underfill material
JP2005093826A (ja) * 2003-09-18 2005-04-07 Ricoh Co Ltd 導電性接着剤による接続構造体及びその製造方法

Also Published As

Publication number Publication date
JPH0424859B2 (enExample) 1992-04-28

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