JPS62145340U - - Google Patents
Info
- Publication number
- JPS62145340U JPS62145340U JP3280186U JP3280186U JPS62145340U JP S62145340 U JPS62145340 U JP S62145340U JP 3280186 U JP3280186 U JP 3280186U JP 3280186 U JP3280186 U JP 3280186U JP S62145340 U JPS62145340 U JP S62145340U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- heat sink
- fixing base
- top surface
- chip fixing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 2
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3280186U JPH0442924Y2 (fi) | 1986-03-06 | 1986-03-06 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3280186U JPH0442924Y2 (fi) | 1986-03-06 | 1986-03-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62145340U true JPS62145340U (fi) | 1987-09-12 |
JPH0442924Y2 JPH0442924Y2 (fi) | 1992-10-12 |
Family
ID=30839823
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3280186U Expired JPH0442924Y2 (fi) | 1986-03-06 | 1986-03-06 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0442924Y2 (fi) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0786441A (ja) * | 1993-09-14 | 1995-03-31 | Nec Corp | 半導体素子パッケージ |
-
1986
- 1986-03-06 JP JP3280186U patent/JPH0442924Y2/ja not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0786441A (ja) * | 1993-09-14 | 1995-03-31 | Nec Corp | 半導体素子パッケージ |
Also Published As
Publication number | Publication date |
---|---|
JPH0442924Y2 (fi) | 1992-10-12 |
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