JPS62145341U - - Google Patents
Info
- Publication number
- JPS62145341U JPS62145341U JP1986032802U JP3280286U JPS62145341U JP S62145341 U JPS62145341 U JP S62145341U JP 1986032802 U JP1986032802 U JP 1986032802U JP 3280286 U JP3280286 U JP 3280286U JP S62145341 U JPS62145341 U JP S62145341U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- semiconductor chip
- metallized layer
- ceramic
- metallized
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 4
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986032802U JPS62145341U (fi) | 1986-03-06 | 1986-03-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986032802U JPS62145341U (fi) | 1986-03-06 | 1986-03-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62145341U true JPS62145341U (fi) | 1987-09-12 |
Family
ID=30839825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986032802U Pending JPS62145341U (fi) | 1986-03-06 | 1986-03-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62145341U (fi) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57121256A (en) * | 1981-01-21 | 1982-07-28 | Hitachi Ltd | Ceramic multilayer wiring structure |
-
1986
- 1986-03-06 JP JP1986032802U patent/JPS62145341U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57121256A (en) * | 1981-01-21 | 1982-07-28 | Hitachi Ltd | Ceramic multilayer wiring structure |