JPH01171036U - - Google Patents

Info

Publication number
JPH01171036U
JPH01171036U JP6787488U JP6787488U JPH01171036U JP H01171036 U JPH01171036 U JP H01171036U JP 6787488 U JP6787488 U JP 6787488U JP 6787488 U JP6787488 U JP 6787488U JP H01171036 U JPH01171036 U JP H01171036U
Authority
JP
Japan
Prior art keywords
package
sealing
sealing layer
groove
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6787488U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6787488U priority Critical patent/JPH01171036U/ja
Publication of JPH01171036U publication Critical patent/JPH01171036U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP6787488U 1988-05-23 1988-05-23 Pending JPH01171036U (fi)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6787488U JPH01171036U (fi) 1988-05-23 1988-05-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6787488U JPH01171036U (fi) 1988-05-23 1988-05-23

Publications (1)

Publication Number Publication Date
JPH01171036U true JPH01171036U (fi) 1989-12-04

Family

ID=31293217

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6787488U Pending JPH01171036U (fi) 1988-05-23 1988-05-23

Country Status (1)

Country Link
JP (1) JPH01171036U (fi)

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