JPH01171036U - - Google Patents
Info
- Publication number
- JPH01171036U JPH01171036U JP6787488U JP6787488U JPH01171036U JP H01171036 U JPH01171036 U JP H01171036U JP 6787488 U JP6787488 U JP 6787488U JP 6787488 U JP6787488 U JP 6787488U JP H01171036 U JPH01171036 U JP H01171036U
- Authority
- JP
- Japan
- Prior art keywords
- package
- sealing
- sealing layer
- groove
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 3
- 239000003566 sealing material Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例のパツケージの組立
状態の断面図、第２図は第１図の構造の組立て前
の断面図、第３図は第２図のセラミツク基板の平
面図、第４図ａは本考案のパツケージにおける封
着強度分布、第４図ｂは従来構造のパツケージに
おける封着強度分布、第５図は従来のパツケージ
組立て状態の断面図、第６図は第５図の構造のセ
ラミツク基板の平面図である。
１……セラミツク基板、２……メタライズ層、
３……アルミナセラミツク層、４……溝、５……
リード端子、６……セラミツクキヤツプ、７……
ガラスシール材。
FIG. 1 is a sectional view of a package according to an embodiment of the present invention in an assembled state, FIG. 2 is a sectional view of the structure of FIG. 1 before assembly, and FIG. 3 is a plan view of the ceramic substrate of FIG. Figure 4a shows the sealing strength distribution in the package of the present invention, Figure 4b shows the sealing strength distribution in the conventional package, Figure 5 is a sectional view of the conventional package assembled, and Figure 6 shows the sealing strength distribution in the package of the present invention. FIG. 3 is a plan view of the ceramic substrate of the structure. 1... Ceramic substrate, 2... Metallized layer,
3...Alumina ceramic layer, 4...Groove, 5...
Lead terminal, 6... Ceramic cap, 7...
Glass sealing material.
Claims (1)
ヤツプの開口面に装着したガラスシール材を熱圧
着により前記シール層に接着して封止を行う半導
体装置用パツケージにおいて、前記シール層の表
面に溝を形成し、ガラスシール材がこの溝内に充
填されるように構成したことを特徴とする半導体
装置用パツケーシ。 In a package for a semiconductor device in which a sealing layer is formed on the upper surface of a ceramic substrate and a glass sealing material attached to the opening surface of the cap is bonded to the sealing layer by thermocompression bonding for sealing, grooves are formed on the surface of the sealing layer. 1. A package for a semiconductor device, characterized in that a glass sealing material is formed in the groove and filled in the groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6787488U JPH01171036U (en) | 1988-05-23 | 1988-05-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6787488U JPH01171036U (en) | 1988-05-23 | 1988-05-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01171036U true JPH01171036U (en) | 1989-12-04 |
Family
ID=31293217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6787488U Pending JPH01171036U (en) | 1988-05-23 | 1988-05-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01171036U (en) |
-
1988
- 1988-05-23 JP JP6787488U patent/JPH01171036U/ja active Pending
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