JPS6214489A - プリント配線板の高周波接続線 - Google Patents
プリント配線板の高周波接続線Info
- Publication number
- JPS6214489A JPS6214489A JP15228185A JP15228185A JPS6214489A JP S6214489 A JPS6214489 A JP S6214489A JP 15228185 A JP15228185 A JP 15228185A JP 15228185 A JP15228185 A JP 15228185A JP S6214489 A JPS6214489 A JP S6214489A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- connection line
- conductor pattern
- high frequency
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 28
- 238000007747 plating Methods 0.000 claims description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 16
- 239000011889 copper foil Substances 0.000 claims description 16
- 238000010586 diagram Methods 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
- Waveguides (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15228185A JPS6214489A (ja) | 1985-07-12 | 1985-07-12 | プリント配線板の高周波接続線 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15228185A JPS6214489A (ja) | 1985-07-12 | 1985-07-12 | プリント配線板の高周波接続線 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6214489A true JPS6214489A (ja) | 1987-01-23 |
| JPH0413873B2 JPH0413873B2 (enExample) | 1992-03-11 |
Family
ID=15537084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15228185A Granted JPS6214489A (ja) | 1985-07-12 | 1985-07-12 | プリント配線板の高周波接続線 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6214489A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05206678A (ja) * | 1992-01-28 | 1993-08-13 | Nec Corp | 多層配線基板 |
| US6635853B2 (en) | 1909-08-09 | 2003-10-21 | Ibiden Co., Ltd. | Hot plate unit |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52136362A (en) * | 1976-05-10 | 1977-11-15 | Hitachi Ltd | Parallel pattern bus line |
| JPS5536901A (en) * | 1978-08-25 | 1980-03-14 | Fujitsu Ltd | Printed board |
| JPS5723001U (enExample) * | 1980-07-14 | 1982-02-05 | ||
| JPS5929801U (ja) * | 1982-08-18 | 1984-02-24 | 三菱電機株式会社 | 半導体移相器 |
-
1985
- 1985-07-12 JP JP15228185A patent/JPS6214489A/ja active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52136362A (en) * | 1976-05-10 | 1977-11-15 | Hitachi Ltd | Parallel pattern bus line |
| JPS5536901A (en) * | 1978-08-25 | 1980-03-14 | Fujitsu Ltd | Printed board |
| JPS5723001U (enExample) * | 1980-07-14 | 1982-02-05 | ||
| JPS5929801U (ja) * | 1982-08-18 | 1984-02-24 | 三菱電機株式会社 | 半導体移相器 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6635853B2 (en) | 1909-08-09 | 2003-10-21 | Ibiden Co., Ltd. | Hot plate unit |
| JPH05206678A (ja) * | 1992-01-28 | 1993-08-13 | Nec Corp | 多層配線基板 |
| US6639191B2 (en) | 1999-01-25 | 2003-10-28 | Ibiden Co., Ltd. | Hot plate unit |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0413873B2 (enExample) | 1992-03-11 |
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