JPH0237096B2 - - Google Patents
Info
- Publication number
- JPH0237096B2 JPH0237096B2 JP61149407A JP14940786A JPH0237096B2 JP H0237096 B2 JPH0237096 B2 JP H0237096B2 JP 61149407 A JP61149407 A JP 61149407A JP 14940786 A JP14940786 A JP 14940786A JP H0237096 B2 JPH0237096 B2 JP H0237096B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring boards
- connection
- tube
- hollow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 claims description 25
- 238000007747 plating Methods 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 239000011889 copper foil Substances 0.000 claims description 14
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000007689 inspection Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 241001076195 Lampsilis ovata Species 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Combinations Of Printed Boards (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61149407A JPS636892A (ja) | 1986-06-27 | 1986-06-27 | プリント配線板間の高周波接続方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61149407A JPS636892A (ja) | 1986-06-27 | 1986-06-27 | プリント配線板間の高周波接続方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS636892A JPS636892A (ja) | 1988-01-12 |
| JPH0237096B2 true JPH0237096B2 (enExample) | 1990-08-22 |
Family
ID=15474452
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61149407A Granted JPS636892A (ja) | 1986-06-27 | 1986-06-27 | プリント配線板間の高周波接続方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS636892A (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0436551Y2 (enExample) * | 1987-03-30 | 1992-08-28 | ||
| JP2527614Y2 (ja) * | 1989-10-17 | 1997-03-05 | サンクス株式会社 | Ｌｅｄプリントヘッド並びに該プリントヘッドに用いるコネクタ |
| JP3597326B2 (ja) * | 1996-09-04 | 2004-12-08 | アルプス電気株式会社 | 高周波機器及びそれを用いた電子機器 |
| JP6859165B2 (ja) * | 2017-04-10 | 2021-04-14 | キヤノン株式会社 | 多層配線基板 |
-
1986
- 1986-06-27 JP JP61149407A patent/JPS636892A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS636892A (ja) | 1988-01-12 |
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