JPS621447Y2 - - Google Patents
Info
- Publication number
- JPS621447Y2 JPS621447Y2 JP6543881U JP6543881U JPS621447Y2 JP S621447 Y2 JPS621447 Y2 JP S621447Y2 JP 6543881 U JP6543881 U JP 6543881U JP 6543881 U JP6543881 U JP 6543881U JP S621447 Y2 JPS621447 Y2 JP S621447Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- screw
- heat sink
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005476 soldering Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 241000289690 Xenarthra Species 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Connection Of Plates (AREA)
- Standing Axle, Rod, Or Tube Structures Coupled By Welding, Adhesion, Or Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6543881U JPS621447Y2 (ko) | 1981-05-06 | 1981-05-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6543881U JPS621447Y2 (ko) | 1981-05-06 | 1981-05-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57176909U JPS57176909U (ko) | 1982-11-09 |
| JPS621447Y2 true JPS621447Y2 (ko) | 1987-01-14 |
Family
ID=29861476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6543881U Expired JPS621447Y2 (ko) | 1981-05-06 | 1981-05-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS621447Y2 (ko) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7094577B2 (ja) * | 2020-07-29 | 2022-07-04 | 萩浦工業株式会社 | ねじの緩み止め方法及び保護カバー |
-
1981
- 1981-05-06 JP JP6543881U patent/JPS621447Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57176909U (ko) | 1982-11-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6377462B1 (en) | Circuit board assembly with heat sinking | |
| US4446504A (en) | Mounting means with solderable studs | |
| JPS621447Y2 (ko) | ||
| JP2863981B2 (ja) | ラグ端子およびその取り付け方法 | |
| JP2734318B2 (ja) | 混成集積回路装置の製造方法 | |
| JPS6243345B2 (ko) | ||
| JPH08125383A (ja) | プリント基板装置 | |
| EP0014558B1 (en) | Assembly of an electrical component and a heat sink on a printed circuit board and method of assembling | |
| JPH0617355Y2 (ja) | プリント配線板における放熱板取付構造 | |
| JPS5812449Y2 (ja) | 放熱板付ｉｃの取付装置 | |
| JPH0227566Y2 (ko) | ||
| JPH0644141Y2 (ja) | 基板接続装置 | |
| JPH027481Y2 (ko) | ||
| KR200157480Y1 (ko) | 방열판을 이용한 인쇄회로기판 고정구조물 | |
| JPH0536305Y2 (ko) | ||
| JPH0316314Y2 (ko) | ||
| JPH0217486Y2 (ko) | ||
| JPH03215966A (ja) | 電力用トランジスタ取付装置 | |
| JPH05251839A (ja) | 電気部品取付装置 | |
| JP3557629B2 (ja) | プリント基板への部品取付け方法 | |
| JPS6336693Y2 (ko) | ||
| JPH02214146A (ja) | ヒートシンクの取付構造 | |
| JPS6141240Y2 (ko) | ||
| KR890000065Y1 (ko) | 트랜지스터와 방열판의 고정장치 | |
| JP2001257490A (ja) | 電子機器の放熱構造 |