JPS62142849U - - Google Patents
Info
- Publication number
- JPS62142849U JPS62142849U JP1986031010U JP3101086U JPS62142849U JP S62142849 U JPS62142849 U JP S62142849U JP 1986031010 U JP1986031010 U JP 1986031010U JP 3101086 U JP3101086 U JP 3101086U JP S62142849 U JPS62142849 U JP S62142849U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- conductor pattern
- solder
- substrate
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W72/281—Auxiliary members
- H10W72/287—Flow barriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986031010U JPS62142849U (enExample) | 1986-03-04 | 1986-03-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986031010U JPS62142849U (enExample) | 1986-03-04 | 1986-03-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62142849U true JPS62142849U (enExample) | 1987-09-09 |
Family
ID=30836346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986031010U Pending JPS62142849U (enExample) | 1986-03-04 | 1986-03-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62142849U (enExample) |
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1986
- 1986-03-04 JP JP1986031010U patent/JPS62142849U/ja active Pending