JPS62141038U - - Google Patents

Info

Publication number
JPS62141038U
JPS62141038U JP2947686U JP2947686U JPS62141038U JP S62141038 U JPS62141038 U JP S62141038U JP 2947686 U JP2947686 U JP 2947686U JP 2947686 U JP2947686 U JP 2947686U JP S62141038 U JPS62141038 U JP S62141038U
Authority
JP
Japan
Prior art keywords
reel
separator
filler
adhesive layer
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2947686U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2947686U priority Critical patent/JPS62141038U/ja
Publication of JPS62141038U publication Critical patent/JPS62141038U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesive Tapes (AREA)
  • Die Bonding (AREA)
JP2947686U 1986-03-01 1986-03-01 Pending JPS62141038U (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2947686U JPS62141038U (fr) 1986-03-01 1986-03-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2947686U JPS62141038U (fr) 1986-03-01 1986-03-01

Publications (1)

Publication Number Publication Date
JPS62141038U true JPS62141038U (fr) 1987-09-05

Family

ID=30833389

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2947686U Pending JPS62141038U (fr) 1986-03-01 1986-03-01

Country Status (1)

Country Link
JP (1) JPS62141038U (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0372585A (ja) * 1989-05-29 1991-03-27 Tomoegawa Paper Co Ltd 接着シート及び半導体装置
JPH03296582A (ja) * 1990-04-14 1991-12-27 Tomoegawa Paper Co Ltd 接着シート
JP2001176895A (ja) * 1994-10-31 2001-06-29 Hitachi Chem Co Ltd フィルム状有機ダイボンディング材のラミネ−ト方法、ダイボンディング方法、ラミネ−ト装置、ダイボンディング装置、半導体装置および半導体装置の製造法
JP2009235402A (ja) * 2008-03-05 2009-10-15 Hitachi Chem Co Ltd 接着フィルム

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57196415A (en) * 1981-05-28 1982-12-02 Nitto Electric Ind Co Insulating tape
JPS5947281A (ja) * 1982-09-13 1984-03-16 Nitto Electric Ind Co Ltd 粘着テ−プもしくはシ−トの製造方法
JPS5980482A (ja) * 1982-10-29 1984-05-09 Hitachi Chem Co Ltd 導電性粘着シ−ト
JPS606776A (ja) * 1983-06-27 1985-01-14 Nitto Electric Ind Co Ltd α線シ−ルド用接着フイルム
JPS6028469A (ja) * 1983-07-26 1985-02-13 Aisin Seiki Co Ltd エポキシ樹脂製テ−プ
JPS60102750A (ja) * 1983-11-09 1985-06-06 Nitto Electric Ind Co Ltd 半導体素子固定用導電性接着フイルム
JPS6134085A (ja) * 1984-07-26 1986-02-18 Hitachi Chem Co Ltd フイルム状接合部材

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57196415A (en) * 1981-05-28 1982-12-02 Nitto Electric Ind Co Insulating tape
JPS5947281A (ja) * 1982-09-13 1984-03-16 Nitto Electric Ind Co Ltd 粘着テ−プもしくはシ−トの製造方法
JPS5980482A (ja) * 1982-10-29 1984-05-09 Hitachi Chem Co Ltd 導電性粘着シ−ト
JPS606776A (ja) * 1983-06-27 1985-01-14 Nitto Electric Ind Co Ltd α線シ−ルド用接着フイルム
JPS6028469A (ja) * 1983-07-26 1985-02-13 Aisin Seiki Co Ltd エポキシ樹脂製テ−プ
JPS60102750A (ja) * 1983-11-09 1985-06-06 Nitto Electric Ind Co Ltd 半導体素子固定用導電性接着フイルム
JPS6134085A (ja) * 1984-07-26 1986-02-18 Hitachi Chem Co Ltd フイルム状接合部材

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0372585A (ja) * 1989-05-29 1991-03-27 Tomoegawa Paper Co Ltd 接着シート及び半導体装置
JPH03296582A (ja) * 1990-04-14 1991-12-27 Tomoegawa Paper Co Ltd 接着シート
JP2001176895A (ja) * 1994-10-31 2001-06-29 Hitachi Chem Co Ltd フィルム状有機ダイボンディング材のラミネ−ト方法、ダイボンディング方法、ラミネ−ト装置、ダイボンディング装置、半導体装置および半導体装置の製造法
JP2009235402A (ja) * 2008-03-05 2009-10-15 Hitachi Chem Co Ltd 接着フィルム

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