JPS62140752U - - Google Patents
Info
- Publication number
- JPS62140752U JPS62140752U JP2716486U JP2716486U JPS62140752U JP S62140752 U JPS62140752 U JP S62140752U JP 2716486 U JP2716486 U JP 2716486U JP 2716486 U JP2716486 U JP 2716486U JP S62140752 U JPS62140752 U JP S62140752U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- element mounting
- mounting portion
- view
- integrating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 239000008188 pellet Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 description 2
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案に係るリードフレームの一実施
例を示す部分平面図、第２図は第１図の―線
に沿う断面図、第３図は第１図のリードフレーム
を金型に型締めした状態を示す断面図、第４図は
本考案の他の実施例を示す部分平面図、第５図は
第４図の―線に沿う断面図、第６図は第４図
のリードフレームを金型に型締めした状態を示す
断面図である。第７図はリードフレームの従来例
を示す部分平面図、第８図はリードフレームを樹
脂モールドするための金型を示す平面図、第９図
は第８図の―線に沿う断面図、第１０図は第
９図の要部拡大断面図である。
２…素子搭載部、４…リード、１４…リードフ
レーム、１６…凹部（凹溝）、１７…リードフレ
ーム、１９…凹部（切欠き）。
Fig. 1 is a partial plan view showing an embodiment of the lead frame according to the present invention, Fig. 2 is a sectional view taken along the line - in Fig. 1, and Fig. 3 is a molding of the lead frame shown in Fig. 1 into a mold. 4 is a partial plan view showing another embodiment of the present invention, FIG. 5 is a sectional view taken along line - in FIG. 4, and FIG. 6 is the lead frame shown in FIG. 4. FIG. 3 is a cross-sectional view showing a state in which the mold is clamped in a mold. Fig. 7 is a partial plan view showing a conventional example of a lead frame, Fig. 8 is a plan view showing a mold for resin molding the lead frame, Fig. 9 is a cross-sectional view taken along the - line in Fig. 8; FIG. 10 is an enlarged sectional view of the main part of FIG. 9. 2... Element mounting portion, 4... Lead, 14... Lead frame, 16... Recess (concave groove), 17... Lead frame, 19... Recess (notch).
Claims (1)
部と、該素子搭載部の周辺近傍まで延びてくる複
数のリードとを連結一体化してなるリードフレー
ムの一部に、樹脂注入部となる凹部を形成したこ
とを特徴とするリードフレーム。 A recessed portion serving as a resin injection portion is formed in a part of a lead frame that is formed by connecting and integrating an element mounting portion on which a semiconductor pellet is fixedly mounted and a plurality of leads extending to the vicinity of the periphery of the element mounting portion. A lead frame featuring
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2716486U JPS62140752U (en) | 1986-02-26 | 1986-02-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2716486U JPS62140752U (en) | 1986-02-26 | 1986-02-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62140752U true JPS62140752U (en) | 1987-09-05 |
Family
ID=30828933
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2716486U Pending JPS62140752U (en) | 1986-02-26 | 1986-02-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62140752U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07176650A (en) * | 1993-12-21 | 1995-07-14 | Matsushita Electric Works Ltd | Semiconductor chip carrier |
-
1986
- 1986-02-26 JP JP2716486U patent/JPS62140752U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07176650A (en) * | 1993-12-21 | 1995-07-14 | Matsushita Electric Works Ltd | Semiconductor chip carrier |