JPH028047U - - Google Patents
Info
- Publication number
- JPH028047U JPH028047U JP8548888U JP8548888U JPH028047U JP H028047 U JPH028047 U JP H028047U JP 8548888 U JP8548888 U JP 8548888U JP 8548888 U JP8548888 U JP 8548888U JP H028047 U JPH028047 U JP H028047U
- Authority
- JP
- Japan
- Prior art keywords
- longitudinal direction
- pellet
- leads
- lead frame
- mounts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図と第２図は本考案に係るリードフレーム
の実施例を示す要部平面図とそのＡ−Ａ線断面図
、第３図は第１図及び第２図のリードフレームの
リードと半導体ペレツトを直接電気的に接続した
状態を示す側断面図、第４図は極性付き２極素子
の一具体例を示す樹脂モールド型ダイオードの部
分断面平面図、第５図は従来のリードフレームの
要部平面図である。
２１……連結片、２４……第１リード、２５…
…ペレツトマウント部、２６……第２リード。
1 and 2 are a plan view of a main part and a sectional view taken along the line A-A of the lead frame according to the present invention, and FIG. 3 is a lead and semiconductor of the lead frame shown in FIGS. 1 and 2. Fig. 4 is a partial cross-sectional plan view of a resin molded diode showing a specific example of a polarized bipolar element, and Fig. 5 shows the main components of a conventional lead frame. FIG. 21... Connection piece, 24... First lead, 25...
...Pellet mount section, 26...2nd lead.
Claims (1)
方向に導出・形成されると共に、長手方向に沿つ
て所定の間隔をもつて配列した複数の第１リード
と、上記各第１リードの遊端に一体的に形成され
たペレツトマウント部と、上記各ペレツトマウン
ト部と離隔して対向・配置した複数の第２リード
とを連結一体化して構成したことを特徴とするリ
ードフレーム。 A plurality of first leads are led out and formed in mutually opposite directions substantially perpendicularly to the longitudinal direction of the long connecting piece, and are arranged at predetermined intervals along the longitudinal direction; 1. A lead frame comprising a pellet mount integrally formed at the free end and a plurality of second leads disposed facing and separated from each of the pellet mounts, which are connected and integrated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8548888U JPH028047U (en) | 1988-06-27 | 1988-06-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8548888U JPH028047U (en) | 1988-06-27 | 1988-06-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH028047U true JPH028047U (en) | 1990-01-18 |
Family
ID=31310156
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8548888U Pending JPH028047U (en) | 1988-06-27 | 1988-06-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH028047U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5262095U (en) * | 1975-10-31 | 1977-05-07 | ||
| JP2003518733A (en) * | 1999-11-01 | 2003-06-10 | ゼネラル セミコンダクター，インク． | Planar hybrid diode rectifier bridge |
-
1988
- 1988-06-27 JP JP8548888U patent/JPH028047U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5262095U (en) * | 1975-10-31 | 1977-05-07 | ||
| JP2003518733A (en) * | 1999-11-01 | 2003-06-10 | ゼネラル セミコンダクター，インク． | Planar hybrid diode rectifier bridge |
| JP4975925B2 (en) * | 1999-11-01 | 2012-07-11 | ゼネラル セミコンダクター，インク． | Planar type hybrid diode rectifier bridge |