JPS62140747U - - Google Patents
Info
- Publication number
- JPS62140747U JPS62140747U JP1986027412U JP2741286U JPS62140747U JP S62140747 U JPS62140747 U JP S62140747U JP 1986027412 U JP1986027412 U JP 1986027412U JP 2741286 U JP2741286 U JP 2741286U JP S62140747 U JPS62140747 U JP S62140747U
- Authority
- JP
- Japan
- Prior art keywords
- case
- substrate
- metal foil
- large number
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 7
- 239000011888 foil Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims 4
- 239000004065 semiconductor Substances 0.000 claims 3
- 230000007797 corrosion Effects 0.000 claims 1
- 238000005260 corrosion Methods 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L2224/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
Description
第１図は本考案の一実施例の断面図、第２図は
金属箔の平面図、第３図及び第４図は夫々異なる
従来の断面図である。
１，１１…基板、２…回路、３，１３…導体膜
、４，１４…ケース、５…金属箔、１５…半田、
１５Ａ…金属シート、６，１６…固定ばね、７，
１７…ねじ。
FIG. 1 is a sectional view of an embodiment of the present invention, FIG. 2 is a plan view of a metal foil, and FIGS. 3 and 4 are sectional views of different conventional metal foils. DESCRIPTION OF SYMBOLS 1, 11... Board, 2... Circuit, 3, 13... Conductor film, 4, 14... Case, 5... Metal foil, 15... Solder,
15A...metal sheet, 6, 16...fixing spring, 7,
17...Screw.
Claims (1)
的に固着するとともに、この基板の裏面に設けた
導体膜を前記ケースに電気的に接続するようにし
た半導体装置において、前記基板とケースとの間
に、耐蝕性に優れかつ表面に多数の凹凸を枡目状
に配列形成した金属箔を介装し、この金属箔を挟
圧するように基板とケースとを圧着支持させたこ
とを特徴とする半導体装置。 (2) 金属箔はその全面に亘つて方形をした多数
の微細な凹凸を枡目状に配列してなる実用新案登
録請求の範囲第１項記載の半導体装置。[Claims for Utility Model Registration] (1) A semiconductor in which a substrate constituting an integrated circuit is mechanically fixed onto a case, and a conductive film provided on the back surface of this substrate is electrically connected to the case. In the device, a metal foil having excellent corrosion resistance and having a large number of irregularities arranged in a square pattern on the surface is interposed between the substrate and the case, and the substrate and the case are pressed together so as to sandwich the metal foil. A semiconductor device characterized by being crimped and supported. (2) The semiconductor device according to claim 1, wherein the metal foil has a large number of fine rectangular irregularities arranged in a grid pattern over its entire surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986027412U JPS62140747U (en) | 1986-02-28 | 1986-02-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986027412U JPS62140747U (en) | 1986-02-28 | 1986-02-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62140747U true JPS62140747U (en) | 1987-09-05 |
Family
ID=30829416
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986027412U Pending JPS62140747U (en) | 1986-02-28 | 1986-02-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62140747U (en) |
-
1986
- 1986-02-28 JP JP1986027412U patent/JPS62140747U/ja active Pending
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