JPH01104765U - - Google Patents
Info
- Publication number
- JPH01104765U JPH01104765U JP20046087U JP20046087U JPH01104765U JP H01104765 U JPH01104765 U JP H01104765U JP 20046087 U JP20046087 U JP 20046087U JP 20046087 U JP20046087 U JP 20046087U JP H01104765 U JPH01104765 U JP H01104765U
- Authority
- JP
- Japan
- Prior art keywords
- film resistor
- circuit board
- integrated circuit
- hybrid integrated
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 3
- 238000005476 soldering Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Details Of Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Description
第１図は本考案の混成集積回路基板を示す一部
斜視図、第２図は前記混成集積回路基板の基板の
構成を示す一部平面図、第３図は前記混成集積回
路基板の保護用基板を示す底面図、第４図は第１
図のＡ―Ａ断面を示す一部断面図である。
１……セラミツク基板、１１，１２……導体パ
ターン、１３，１４……半田付け用パターン、２
……保護用基板、２１……半田付け用パターン、
３……膜状抵抗体、４……半田層。
FIG. 1 is a partial perspective view showing the hybrid integrated circuit board of the present invention, FIG. 2 is a partial plan view showing the configuration of the board of the hybrid integrated circuit board, and FIG. 3 is a protection screen for the hybrid integrated circuit board. Bottom view showing the board, Figure 4 is the first
It is a partial sectional view showing the AA cross section of the figure. 1... Ceramic board, 11, 12... Conductor pattern, 13, 14... Soldering pattern, 2
...Protection board, 21...Soldering pattern,
3... Film resistor, 4... Solder layer.
Claims (1)
形成して成る混成集積回路基板において、絶縁基
板上に、前記膜状抵抗体の表面から離して、該膜
状抵抗体を覆う絶縁板を固定配設したことを特徴
とする混成集積回路基板。 (2) 実用新案登録請求の範囲第１項において、
前記膜状抵抗体を覆う絶縁板は、前記絶縁基板上
に形成された回路パターンの一部を利用して固定
されていることを特徴とする混成集積回路基板。 (3) 実用新案登録請求の範囲第１項において、
前記膜状抵抗体を覆う絶縁板は、その表面にも回
路が形成されていることを特徴とする混成集積回
路基板。[Claims for Utility Model Registration] (1) In a hybrid integrated circuit board comprising a circuit pattern and a film resistor formed on an insulating substrate, a circuit pattern and a film resistor are formed on the insulating substrate, separated from the surface of the film resistor. A hybrid integrated circuit board characterized by having an insulating plate fixedly arranged to cover a film resistor. (2) In paragraph 1 of the claims for utility model registration,
A hybrid integrated circuit board characterized in that an insulating plate covering the film resistor is fixed using a part of a circuit pattern formed on the insulating substrate. (3) In paragraph 1 of the claims for utility model registration,
A hybrid integrated circuit board characterized in that the insulating plate covering the film resistor has a circuit formed thereon as well.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987200460U JPH0514548Y2 (en) | 1987-12-30 | 1987-12-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987200460U JPH0514548Y2 (en) | 1987-12-30 | 1987-12-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01104765U true JPH01104765U (en) | 1989-07-14 |
| JPH0514548Y2 JPH0514548Y2 (en) | 1993-04-19 |
Family
ID=31490866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987200460U Expired - Lifetime JPH0514548Y2 (en) | 1987-12-30 | 1987-12-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0514548Y2 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5386465A (en) * | 1977-01-08 | 1978-07-29 | Mitsubishi Electric Corp | Semiconductor device |
| JPS6049693U (en) * | 1983-09-14 | 1985-04-08 | 株式会社日立製作所 | thick film circuit board |
| JPS60124856A (en) * | 1983-12-09 | 1985-07-03 | Toshiba Corp | Manufacture of electronic parts |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6049693B2 (en) * | 1982-01-20 | 1985-11-05 | ロザイ工業株式会社 | Rapid quenching method for slabs |
-
1987
- 1987-12-30 JP JP1987200460U patent/JPH0514548Y2/ja not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5386465A (en) * | 1977-01-08 | 1978-07-29 | Mitsubishi Electric Corp | Semiconductor device |
| JPS6049693U (en) * | 1983-09-14 | 1985-04-08 | 株式会社日立製作所 | thick film circuit board |
| JPS60124856A (en) * | 1983-12-09 | 1985-07-03 | Toshiba Corp | Manufacture of electronic parts |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0514548Y2 (en) | 1993-04-19 |