JPS62138454U - - Google Patents

Info

Publication number
JPS62138454U
JPS62138454U JP1986026175U JP2617586U JPS62138454U JP S62138454 U JPS62138454 U JP S62138454U JP 1986026175 U JP1986026175 U JP 1986026175U JP 2617586 U JP2617586 U JP 2617586U JP S62138454 U JPS62138454 U JP S62138454U
Authority
JP
Japan
Prior art keywords
screw
view
integrated circuit
hole
flat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986026175U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0442926Y2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986026175U priority Critical patent/JPH0442926Y2/ja
Priority to DE8787301651T priority patent/DE3766384D1/de
Priority to EP87301651A priority patent/EP0236065B1/en
Priority to US07/018,408 priority patent/US4781244A/en
Publication of JPS62138454U publication Critical patent/JPS62138454U/ja
Application granted granted Critical
Publication of JPH0442926Y2 publication Critical patent/JPH0442926Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

Landscapes

  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
JP1986026175U 1986-02-25 1986-02-25 Expired JPH0442926Y2 (enrdf_load_stackoverflow)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP1986026175U JPH0442926Y2 (enrdf_load_stackoverflow) 1986-02-25 1986-02-25
DE8787301651T DE3766384D1 (de) 1986-02-25 1987-02-25 Fluessigkeitskuehlungssystem fuer integrierte schaltungschips.
EP87301651A EP0236065B1 (en) 1986-02-25 1987-02-25 Liquid cooling system for integrated circuit chips
US07/018,408 US4781244A (en) 1986-02-25 1987-02-25 Liquid cooling system for integrated circuit chips

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986026175U JPH0442926Y2 (enrdf_load_stackoverflow) 1986-02-25 1986-02-25

Publications (2)

Publication Number Publication Date
JPS62138454U true JPS62138454U (enrdf_load_stackoverflow) 1987-09-01
JPH0442926Y2 JPH0442926Y2 (enrdf_load_stackoverflow) 1992-10-12

Family

ID=30827010

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986026175U Expired JPH0442926Y2 (enrdf_load_stackoverflow) 1986-02-25 1986-02-25

Country Status (1)

Country Link
JP (1) JPH0442926Y2 (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011028888A (ja) * 2009-07-22 2011-02-10 Yu-Lin Chu Ｌｅｄ灯の放熱構造
JP2015073004A (ja) * 2013-10-02 2015-04-16 富士通株式会社 冷却装置、電子機器および冷却装置の取付方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011028888A (ja) * 2009-07-22 2011-02-10 Yu-Lin Chu Ｌｅｄ灯の放熱構造
JP2015073004A (ja) * 2013-10-02 2015-04-16 富士通株式会社 冷却装置、電子機器および冷却装置の取付方法

Also Published As

Publication number Publication date
JPH0442926Y2 (enrdf_load_stackoverflow) 1992-10-12

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