JPS6213823B2 - - Google Patents
Info
- Publication number
- JPS6213823B2 JPS6213823B2 JP55183967A JP18396780A JPS6213823B2 JP S6213823 B2 JPS6213823 B2 JP S6213823B2 JP 55183967 A JP55183967 A JP 55183967A JP 18396780 A JP18396780 A JP 18396780A JP S6213823 B2 JPS6213823 B2 JP S6213823B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- alloy
- copper
- conductivity
- solderability
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010949 copper Substances 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 6
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 3
- 239000012535 impurity Substances 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 description 15
- 239000000956 alloy Substances 0.000 description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18396780A JPS57109357A (en) | 1980-12-26 | 1980-12-26 | Copper alloy for semiconductor device lead |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18396780A JPS57109357A (en) | 1980-12-26 | 1980-12-26 | Copper alloy for semiconductor device lead |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57109357A JPS57109357A (en) | 1982-07-07 |
| JPS6213823B2 true JPS6213823B2 (US20090163788A1-20090625-C00002.png) | 1987-03-28 |
Family
ID=16144949
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18396780A Granted JPS57109357A (en) | 1980-12-26 | 1980-12-26 | Copper alloy for semiconductor device lead |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57109357A (US20090163788A1-20090625-C00002.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007100145A (ja) * | 2005-09-30 | 2007-04-19 | Dowa Holdings Co Ltd | 曲げ加工性と疲労特性を改善した銅合金板材 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR840001426B1 (ko) * | 1982-10-20 | 1984-09-26 | 이영세 | 전기전자 부품용 동합금 및 동합금판의 제조방법 |
| JPS60221541A (ja) * | 1984-04-07 | 1985-11-06 | Kobe Steel Ltd | 熱間加工性の優れた銅合金 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5278621A (en) * | 1975-12-26 | 1977-07-02 | Tamagawa Kikai Kinzoku Kk | Copper alloy for lead frames of semiconductor elements |
| JPS5315070A (en) * | 1976-07-28 | 1978-02-10 | Toshiba Corp | Semiconductor device |
| JPS54100257A (en) * | 1978-01-25 | 1979-08-07 | Toshiba Corp | Lead frame |
-
1980
- 1980-12-26 JP JP18396780A patent/JPS57109357A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5278621A (en) * | 1975-12-26 | 1977-07-02 | Tamagawa Kikai Kinzoku Kk | Copper alloy for lead frames of semiconductor elements |
| JPS5315070A (en) * | 1976-07-28 | 1978-02-10 | Toshiba Corp | Semiconductor device |
| JPS54100257A (en) * | 1978-01-25 | 1979-08-07 | Toshiba Corp | Lead frame |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007100145A (ja) * | 2005-09-30 | 2007-04-19 | Dowa Holdings Co Ltd | 曲げ加工性と疲労特性を改善した銅合金板材 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57109357A (en) | 1982-07-07 |
